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muRata LQP03HQ2N7B02D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata LQP03HQ2N7B02D
- Type
- MURATA
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQP03HQ2N7B02D
- Electronic Component
- 1
- Package
- 0201
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.008g
- Inductor
- 2.7nH
- Electronic Component
- 1
- Factor
- 20@500MHz
- Electronic Component
- BM0264255611
- Current
- 600mA
- Frequency
- 9GHz
- Resistor(DCR)
- 120mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LQP03HQ2N7B02D 产品概述
一、产品简介
LQP03HQ2N7B02D 是村田（muRata）出品的一款0201（0603公制）尺寸无屏蔽厚膜射频电感。标称电感值为 2.7 nH，面向高频射频匹配、无源滤波及信号线去耦等微小空间应用场景，兼顾小封装与高频性能。
二、主要参数与性能
- 电感值：2.7 nH
- 额定电流：600 mA（额定通过电流，长期使用建议留有裕量）
- 直流电阻（DCR）：最大 120 mΩ
- 品质因数（Q）：20 @ 500 MHz
- 自谐振频率（SRF）：9 GHz
- 类型：厚膜电感，非屏蔽结构
- 封装：0201（0603 公制）
这些参数表明器件在数百MHz 到数GHz 频段具有良好 Q 值与极高的自谐振上限，适合要求小寄生和高频响应的射频电路。
三、结构与封装特点
厚膜工艺使得器件尺寸极小且加工一致性好，适合高密度贴片组装。无屏蔽设计在体积和成本上有优势，但在对外磁场耦合敏感的场合需留意布局与屏蔽策略。0201 封装对焊盘设计、回流工艺和拾放精度要求较高。
四、典型应用场景
- 射频前端匹配网络（手机、无线模块）
- 高频滤波与谐振电路
- PCB 信号线终端去耦与阻抗调整
- 小型化消费电子与穿戴设备的射频子系统
五、选型与使用建议
- 频率使用：工作频率应远低于 SRF（9 GHz），靠近 SRF 时电感值显著下降，应通过仿真与实测验证。
- 电流与热：600 mA 为金属导体与温升限定值，实际应用中建议留有裕量并考虑温度系数与热散布。
- 布局：采用短且宽的引线与良好地面参考可以减少寄生与串扰；如需屏蔽效果，可在 PCB 设计中加入金属罩或屏蔽层。
- 焊接：遵循厂商回流温度曲线，注意0201封装的热循环可靠性与焊膏用量。
六、可靠性与测试要点
建议在目标板上进行 L、Q 与 S 参数测量（矢量网络分析仪）以确认实际频率响应；进行温度循环、机械震动与潮湿测试以验证长期可靠性。针对高频应用，应评估器件在 PCB 上的自谐振偏移与 Q 曲线变化。
总结：LQP03HQ2N7B02D 以其极小尺寸与良好高频性能，适合对体积与频带有严格要求的射频与高频应用，但在电流承载与屏蔽需求上需结合具体电路进行权衡与验证。
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