Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM033R61A224ME90D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- mu Rata GRM033R61A224ME90D
- Type
- MURATA
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM033R61A224ME90D
- Electronic Component
- 1
- Electronic Component
- 220nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0084346446
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：GRM033R61A224ME90D
基本信息
GRM033R61A224ME90D 是由村田（muRata）公司生产的一款高性能多层陶瓷电容器（MLCC），其电容值为0.22µF（或220nF），采用表面贴装设计，封装规格为0201（对应0603公制尺寸）。本电容器的额定电压为10V，具有±20%的容差范围、X5R温度系数，工作温度范围为-55°C至85°C，使其成为一款在多个应用场景中均可使用的通用型电容器。
参数细节
- 电容值：0.22µF，适合滤波、耦合及解耦等电路应用。
- 容差：±20%，此容差范围确保了电容器在允许的参数变动内运行，适合为各种电子设备提供稳定的电容值。
- 额定电压：10V，这意味着该电容器在高达10伏的电压下工作时能够维持其性能，而不会发生击穿。
- 温度系数：X5R，表示电容的电容值在-55°C至85°C之间变化较小，通常在±15%以内，因此适合在温度变化较大的环境下使用。
- 工作温度范围：-55°C至85°C，体现了其宽广的适用环境，能够满足极端工作温度的需求。
- 安装类型：表面贴装（SMD），方便与其他组件在电路板上实现高效的集成。
- 封装/外壳尺寸：0201（0.6mm x 0.3mm），小巧的尺寸使得其在现代小型化电子设备中的应用极为广泛。
应用领域
GRM033R61A224ME90D 适用于多种电子产品，包括但不限于：
- 消费电子：如智能手机、平板电脑等移动设备中用于电源管理和信号处理。
- 工业设备：用于稳压与滤波电路，保障长期稳定运行。
- 汽车电子：适应汽车电子控制单元（ECU），满足汽车高温和恶劣环境下工作的需求。
- 计算机及通讯设备：应用于数据传输线路中的旁路和耦合，提高信号完整性。
竞争优势
村田作为全球知名的电子元器件制造商，其产品以高可靠性和优良的性能著称。GRM033R61A224ME90D电容器采用顶尖的陶瓷材料和独特的制造工艺，使其在电气特性、热稳定性上相较于市场上同类产品具有显著的优势。这使得其在设计上可以降低功耗、提升工作性能，并且延长设备的使用寿命。
另外，该电容器的小型化设计使得它可以在空间受限的电路设计中成为理想选择，帮助设计师优化电路板布局，实现更紧凑的设计，特别是在当前产品轻薄化的趋势下尤为重要。
总结
GRM033R61A224ME90D 电容器是一款综合性能优秀且应用广泛的表面贴装多层陶瓷电容器，适合多种电子产品应用。在现代电子设备的小型化趋势中，该电容器凭借其优异的电气特性和稳定性，成为设计工程师的首选器件。此外，村田的品牌保证和产品质量也为其在激烈的市场竞争中增添了不少信心。无论是在高温应用、紧凑设计还是要求高信号完整性的场合，GRM033R61A224ME90D都能提供卓越的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
