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muRata LQP03TN1N9B02D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata LQP03TN1N9B02D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQP03TN1N9B02D
- Electronic Component
- 1
- Package
- 0201
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- 0.008g
- Inductor
- 1.9nH
- Electronic Component
- 1
- Factor
- 14@500MHz
- Electronic Component
- BM0058421598
- Current
- 600mA
- Frequency
- 12.5GHz
- Resistor(DCR)
- 150mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LQP03TN1N9B02D产品概述
一、产品简介
LQP03TN1N9B02D是村田（muRata）生产的一款0201封装厚膜贴片电感，标称电感值为1.9nH。该器件以极小封装实现高频性能优化，适用于对体积和频率响应有严格要求的移动终端和射频前端电路。其典型参数为直流电阻（DCR）150mΩ，品质因数Q=14（@500MHz），自谐振频率（SRF）12.5GHz，额定电流（Irms）600mA。
二、主要电气性能
- 电感值：1.9nH，适合微波与射频偏置、阻抗匹配或滤波用途。
- 直流电阻：150mΩ，说明在直流和低频条件下功耗较小，有助于降低直流损耗和发热。
- 品质因数（Q）：14@500MHz，表明在高频段有较好的能量存储能力与较低的损耗，适合高频滤波与谐振回路。
- 自谐振频率：12.5GHz，器件在此频率以上表现将受到寄生电容影响，应避免在SRF附近直接工作。
- 额定电流：600mA，适用于中等电流的偏置网络与电源去耦。
三、典型应用场景
- 射频前端（RFFE）：用于阻抗匹配、陷波或包络控制等。
- 高频滤波与谐振回路：在较高频段进行带通/带阻滤波或谐振器件配合。
- 电源滤波：用于DC-DC转换器输出或偏置线路的射频抑制。
- 移动设备、无线模块、蓝牙/Wi‑Fi/LTE射频链路等空间受限应用。
四、封装与焊接建议
0201超微小封装对贴装与回流焊工艺要求较高：
- PCB焊盘设计应严格按照厂商推荐尺寸，焊膏量要均匀以避免偏位或桥锡。
- 回流温度曲线需控制在器件规格内，避免过高温度导致材料性能退化。
- 在拆卸或重新流焊时注意热循环次数限制，防止机械或热损伤。
五、选型与可靠性注意事项
- 频率选择：工作频率应显著低于SRF（12.5GHz）以保证电感特性稳定。
- 温漂与电流效应：高电流或高温条件下电感值可能发生一定变化，需在系统仿真中考虑其非线性。
- 尺寸与布局：0201封装利于高密度布局，但对贴片精度和机械强度有更高要求。
- 质量控制：建议在量产前进行S-参数或阻抗测试以确认在目标频段的实际表现，并做热循环与湿热可靠性测试。
本产品以小体积与良好高频性能为特点，适用于对空间与频段有严格要求的现代射频与高频电路。根据具体应用场景对电感值、Q值和电流容量进行权衡，可获得最佳系统性能。
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