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muRata LQM18PN2R2MFRL
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata LQM18PN2R2MFRL
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- LQM18PN2R2MFRL
- Electronic Component
- 1
- Package
- 0603
- Type
- Inductor
- Electronic Component
- SMD Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.034g
- Inductor
- 2.2uH
- Electronic Component
- 1
- Electronic Component
- BM0058416997
- Current
- 750mA
- Frequency
- 70MHz
- Resistor(DCR)
- 300mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LQM18PN2R2MFRL — 0603 叠层贴片电感（2.2µH ±20%）
一、产品简介
LQM18PN2R2MFRL 为 muRata（村田）出品的 0603（1608公制）叠层贴片电感，标称电感值 2.2µH，公差 ±20%，直流电阻（DCR）约 300mΩ，自谐振频率（SRF）约 70MHz，额定电流 750mA。该器件体积小、适合高密度贴片工艺，常用于滤波、去耦和 EMI 抑制场景。
二、关键参数解读
- 电感值：2.2µH（±20%），适合中低频滤波与能量储存要求不高的电路。
- 直流电阻（DCR）：约 300mΩ，较高的 DCR 会带来额外 I²R 损耗，影响转换效率，但可提供阻尼，抑制谐振。
- 自谐频率（SRF）：≈70MHz，器件在 SRF 以下表现为感性元件；接近或超过 SRF 时电感值显著下降并出现容性行为。
- 额定电流：750mA；在接近额定电流时电感会出现直流偏置效应，实际电感值会下降。
- 类型与封装：叠层（MLI）结构，0603 封装，适用于无引脚的表面贴装工艺。
三、性能与热耗注意
在 750mA 直流电流下的理论功耗约为 P = I²·R ≈ 0.75²×0.3 ≈ 0.17W，实际温升受封装导热及 PCB 散热条件影响。使用时应考虑直流偏置导致的电感下降以及 DCR 带来的损耗，必要时做实际电路下的测量验证。
四、典型应用
- 电源线滤波（输入/输出去耦）
- EMI/射频抑制（作为共模或差模抑制元件，频段需在 SRF 以下）
- 小功率 DC-DC 降压/升压变换器的输出滤波（对效率要求不严场合）
- 耐冲击与表面贴装空间受限的便携设备
五、封装与装配建议
- 推荐采用标准无铅回流焊工艺（请参照村田官方资料的回流曲线）。
- PCB 焊盘设计、锡膏量和回流温度直接影响焊接可靠性，建议按厂商 land pattern 进行设计与验证。
- 避免在回流或机械应力下对元件施加过大压力，防止裂纹与性能退化。
- 在高温或高电流环境下，应评估元件温升并留有散热空间。
六、选型提示
- 若对功率损耗与效率敏感，优先考虑低 DCR 或专用功率电感；本型号更适合以滤波/阻尼为主的应用。
- 设计时应考虑电流偏置对电感值的影响，建议在实际工作电流条件下测量频率响应与电感值。
- 如需在射频高频段工作，应保证工作频率远低于 SRF，或选择 SRF 更高的器件。
如需更详细的电气特性曲线、温升曲线、封装尺寸或推荐 PCB land pattern，请参照 muRata 官方数据手册或告知具体工作环境，我可帮您进一步分析与选型建议。
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