WMSIC Electronic Components

muRata LQP03TN2N8B02D

ModelLQP03TN2N8B02D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata LQP03TN2N8B02D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQP03TN2N8B02D
Electronic Component
1
Package
0201
Type
Inductor
Electronic Component
SMD Inductor
Electronic Component
0.008g
Inductor
2.8nH
Electronic Component
1
Factor
14@500MHz
Electronic Component
BM0258886038
Current
500mA
Frequency
9.5GHz
Resistor(DCR)
200mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LQP03TN2N8B02D 产品概述

一、产品简介

LQP03TN2N8B02D 为 muRata(村田)系列贴片厚膜电感,封装标称 0201(0603 公制)。该器件以超小体积实现优良的高频特性,适用于对体积与频率响应有严格要求的射频和通讯终端电路。典型应用包括射频匹配、滤波、偏置供电以及 EMI 抑制等。

二、主要参数与性能

  • 电感值:2.8 nH
  • 额定电流:500 mA
  • 直流电阻(DCR):约 200 mΩ
  • 品质因数(Q):14 @ 500 MHz
  • 自谐振频率(SRF):9.5 GHz
  • 类型:厚膜电感,表面贴装(0201)

这些参数表明该器件在数百兆到多吉赫频段具有良好能量传输效率和低损耗表现,适合高频匹配元件及输入/输出阻抗整形使用。

三、性能解析与注意事项

  • 高频行为:在低频区表现为纯电感性,接近 SRF 时电感量减小并逐渐出现寄生电容效应;超过 SRF 后行为转为容性,故在设计时应避免工作频率接近或超过 9.5 GHz。
  • 热与电流限制:额定电流 500 mA 对应器件在持续导通下的温升与 DCR 导致的功耗需在电路热预算内评估;长期超额电流会引起可靠性下降。
  • 焊接与装配:推荐采用标准 SMT 回流工艺贴装,避免机械应力和过度重复加热;贴装时应保持焊盘对称、走线短以降低寄生影响。

四、PCB 布局与测试建议

  • 布局:将电感尽量靠近射频器件或匹配网络放置,焊盘至器件间连线要最短以减少附加电感与串联损耗;若为地耦合电路,注意与地平面间的隔离以避免不期望的耦合。
  • 测试:使用矢量网络分析仪测量 L、Q 时应对夹具进行去嵌(de-embedding),并在与实际工作频率相同的激励条件下评估参数。

五、典型应用场景

  • 手机与无线终端的射频匹配网络
  • Wi‑Fi、蓝牙及 GPS 前端电路的阻抗调整与滤波
  • 高频信号链中的去耦与 EMI 抑制元件
  • 小型化高频电路设计中作为串联电感使用

六、包装与选型提示

  • 封装 0201 适用于对 PCB 面积极度受限的设计,但也对贴片设备和装配精度提出更高要求。
  • 选型时应综合考虑工作频段、允许电流、直流损耗及在目标频率下的 Q 值,必要时与样品实测数据对比验证。

总结:LQP03TN2N8B02D 以微小封装提供 2.8 nH 的高频电感解决方案,具备 500 mA 的电流能力和在 500 MHz 条件下较好的 Q 值,适合对尺寸与频率响应有高需求的射频与通讯应用。在电路设计与装配中应注意热管理、寄生影响及避免在自谐振频率附近工作以保证最佳性能与可靠性。

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