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muRata GRM0335C1H2R8BA01D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- mu Rata GRM0335C1H2R8BA01D
- Type
- MURATA
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H2R8BA01D
- Electronic Component
- 1
- Electronic Component
- 2.8pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0227340210
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
muRata GRM0335C1H2R8BA01D 产品概述
一、基本参数与概述
GRM0335C1H2R8BA01D 为 muRata（村田）系列贴片多层陶瓷电容（MLCC），主要参数：容值 2.8 pF、介质 C0G（又称 NP0）、额定电压 50 V、封装 0201。C0G 型陶瓷以温度稳定性好、损耗低著称，适用于对频率稳定性和线性度要求较高的电路。
二、介质与温度特性
C0G（NP0）介质的温度系数接近 0 ppm/°C，工作温度范围宽（典型 -55°C 到 +125°C），随温度变化容值极小，长期老化效应可忽略。这使其在高精度振荡器、定时电路和高频射频前端中能保持稳定性能。
三、主要电气性能与应用场景
此型号容值偏小、封装超小，具有低等效串联电感（ESL）与极低损耗（低 DF），适合：高频匹配网络、射频耦合与旁路、振荡器负载、电荷/时钟耦合以及精密滤波与回路调谐等场景。50 V 额定电压为一般信号链与小功率模拟/射频电路提供充足裕量。
四、封装与装配建议
0201 超小封装对贴装精度和焊膏印刷要求较高。建议使用高精度贴装设备、优化焊膏孔形与量，控制回流曲线（兼容无铅回流工艺）。布线时保持焊盘短且对称，尽量减小寄生电感与电容；对关键地平面应采用短回流路径或地盲/埋孔以降低阻抗。
五、可靠性与选型注意事项
C0G MLCC 漏电温度稳定、绝缘电阻高，但超小封装对机械应力敏感，焊接与 PCB 弯曲可能导致裂纹。设计时注意避免较大热循环与机械应力集中；如需更详细的容差、尺寸、等效串联电阻/电感及回流规范，请参考厂家正式规格书并按实际应用环境进行耐久性验证。
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