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muRata GRM0335C1H180JA01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM0335C1H180JA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H180JA01D
- Electronic Component
- 1
- Electronic Component
- 18pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0252997555
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1H180JA01D 产品概述
一、主要参数与特性
GRM0335C1H180JA01D 为 muRata（村田）品牌的贴片多层陶瓷电容（MLCC），主要电气参数如下：容值 18 pF，容差 ±5%（J），额定电压 50 V，温度特性 C0G（又称 NP0），封装 0201。C0G 型陶瓷介质具有非常稳定的温漂（约 0 ±30 ppm/°C）、极低的介质损耗和高 Q 值，容值随温度和直流偏压几乎不变，适用于高精度、高频应用。
二、典型应用
- 射频电路：谐振器、阻抗匹配网络、高频滤波器。
- 振荡与定时：振荡器、晶振外围负载电容、低漂移计时电路。
- 精密模拟：ADC/DAC 前端、采样电路中的耦合与旁路。
- 高速数字：信号完整性要求高的小容量旁路、终端匹配。
因封装为 0201，特别适合空间受限的移动通信、可穿戴、物联网与消费电子产品。
三、封装与装配要点
0201（超小尺寸）对 PCB 设计与贴装有较高要求：
- 采用厂商推荐的焊盘尺寸与过孔布局以降低应力与提升焊接良率；
- 贴装时使用精密贴片机与适配吸嘴，回流焊温度曲线遵循村田资料避免过热；
- 元件体积小，易受机械应力影响，焊后 PCB 弯曲要控制，避免焊点裂纹或电容断裂。
四、可靠性与测试建议
C0G/NP0 陶瓷电容具有最低的老化率和良好的热稳定性，但 0201 尺寸对机械冲击较敏感。建议在量产前做：温循环、振动、焊接热冲击与长时间老化测试；以及实际电路中的频率响应与损耗测试，确保在目标工作点下满足 Q 值与等效串联电阻（ESR）要求。
五、选型与使用建议
- 若需在射频或高精度计时场合获得稳定性能，C0G 是优先选择；
- 设计时考虑电压裕度，但 C0G 对直流偏压影响极小；若空间允许，可并联不同容值以扩展频率响应；
- 采购时留意村田原厂料号与包装（带卷/盒装）信息，避免混淆类似料号的温度特性或精度差异。
总结：GRM0335C1H180JA01D 为一款性能稳定、损耗低的超小型 C0G MLCC，特别适合射频、振荡与精密模拟等需高稳定性的场合，但在 PCB 布局与装配工艺上需严格把控以确保可靠性与一致性。若需更详细的尺寸、焊盘推荐与回流曲线，请参考村田官方数据手册。
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