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muRata GJM1555C1H2R0BB01D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GJM1555C1H2R0BB01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GJM1555C1H2R0BB01D
- Electronic Component
- 1
- Electronic Component
- 2pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0209984646
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM1555C1H2R0BB01D 产品概述
一、核心参数概览
GJM1555C1H2R0BB01D 为村田（muRata）贴片多层陶瓷电容（MLCC），主要参数如下：容值 2 pF，温度系数 C0G（又称 NP0），额定电压 50 V，封装 0402。该型号定位为高稳定性、小容值、高频应用的通用贴片电容。
二、电气与材料特性
C0G/NP0 陶瓷材料的显著特征是温度依赖性极小、介电常数稳定且损耗低，适用于对温漂和频率响应要求高的电路。2 pF 的微小电容值使器件具备很高的自谐振频率（SRF），在射频、微波及高频滤波或匹配网络中表现优异。此外，C0G 类型对直流偏置的依赖极小，适合精密时基、采样与匹配电路。
三、封装与应用场景
0402 尺寸适合空间受限的表面贴装设计，兼顾体积与可靠性。常见应用包括：
- 射频匹配电路与滤波器
- 高频旁路/去耦（对低容值并联使用）
- 晶振、振荡器负载电容与时钟电路
- 精密模拟采样、ADC/放大器输入耦合与补偿
四、设计与装配建议
- 焊接：遵循厂商推荐的回流温度曲线进行贴装，避免过高温度和过长保温时间以降低失效风险。
- 机械应力：小型 MLCC 对焊盘设计和板材弯曲敏感，焊盘、过孔与丝印布局应减小热机械应力，避免贴片在回流或后加工时产生裂纹。
- 电气使用：按额定电压选型，C0G 对直流偏置影响小，但长期过压或脉冲可能导致性能退化；高频应用时注意寄生电感与布局匹配。
- 清洁与储存：常规清洗即可，保持干燥包装以避免吸湿相关问题。
五、选型与注意事项
在最终选型时，建议查询村田官方数据表确认容差、温度范围、等效串联电阻（ESR）与封装外形尺寸等完整参数。若为关键频段或对 Q 值、损耗极为敏感的设计，可要求样片测试或参考厂商射频特性曲线。标准供应形式通常为卷带包装（Tape & Reel），便于量产贴装。
如需对比其他容值、额定电压或不同温度特性的同系列器件，可提供电路工作频段与环境条件，我可协助进一步匹配推荐。
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