WMSIC Electronic Components

muRata GRM0335C1H5R0BA01D

ModelGRM0335C1H5R0BA01D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
mu Rata GRM0335C1H5R0BA01D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM0335C1H5R0BA01D
Electronic Component
1
Electronic Component
5pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0257359346
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM0335C1H5R0BA01D 产品概述

一、产品简介

GRM0335C1H5R0BA01D 为村田(muRata)生产的一款高精度多层陶瓷电容(MLCC),标称电容值为 5 pF,额定电压 50 V,介质为 C0G (NP0)。公差为 ±0.1 pF,属高稳定、低漂移的精密贴片电容,适用于对电容稳定性和温度特性要求较高的电路。

二、主要电气特性

  • 容值:5 pF(标称)
  • 额定电压:50 V DC
  • 温度系数:C0G/NP0(0 ±30 ppm/°C,具有极佳的温度稳定性)
  • 容差:±0.1 pF(高精度)
  • 介质特性:低介电损耗、极低电压依赖性、近乎无介质老化
  • 高频性能:低等效串联电阻(ESR)、高 Q 值,适合射频与高频应用

三、结构与封装

  • 类型:多层陶瓷固体电容(MLCC)
  • 封装:0201(微小封装,适合高密度贴装)
  • 安装方式:表面贴装(SMD) 小尺寸有利于节省 PCB 面积,但对贴装精度和回流工艺有更高要求。

四、典型应用场景

  • 射频电路:谐振回路、阻抗匹配、射频滤波
  • 精密时钟与振荡器:保持频率稳定、减少温漂
  • 精密模拟电路:采样、比较器、传感器接口中的微小旁路与耦合
  • 微型化消费电子与医疗设备:需要小体积与高稳定性的场合

五、设计与焊接建议

  • 回流焊:遵循村田推荐的回流曲线,避免超高峰值温度和热冲击。
  • 贴装:0201 封装对贴装中心度和锡膏印刷要求高,建议使用高精度贴片机与合适的锡膏量。
  • 机械应力:避免在电容上施加过大弯曲或点压,PCB 设计时应考虑减小焊盘与基材热机械应力。
  • 清洗与处理:按厂方工艺建议处理,避免强烈振动或不当清洗导致微裂纹。

六、可靠性与选型建议

C0G(NP0)介质几乎无老化且电气参数随温度和偏置几乎不变,适合对稳定性要求极高的设计。若对容差或温漂有更宽松要求,可考虑体积更大或电容量更高的产品以降低成本;若需要更大容值且接受一定温漂,可选 X7R 或 X5R 系列。选型时同时考虑封装可靠性、贴装良率以及库存策略。

总体而言,GRM0335C1H5R0BA01D 是一款面向微型化、高稳定性与高频性能场景的精密 MLCC,适合要求极低温漂与高可靠性的工业、通信和消费类电子设计。若需更详细的回流曲线、焊盘尺寸或频率响应曲线,建议参考村田官方数据手册。

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