WMSIC Electronic Components

muRata GRM033R61C473KE84D

ModelGRM033R61C473KE84D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM033R61C473KE84D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM033R61C473KE84D
Electronic Component
1
Electronic Component
47nF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0209267065
Electronic Component
X5R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM033R61C473KE84D 产品概述

一、产品要点

  • 型号:GRM033R61C473KE84D(muRata / 村田)
  • 类型:多层陶瓷贴片电容(MLCC)
  • 容值:47 nF(0.047 μF)
  • 额定电压:16 V DC
  • 精度:±10%(K)
  • 温度特性:X5R(-55°C 至 +85°C 温度范围内容值变化在标准X5R限值内)
  • 封装:0201(超小型SMD封装,适用于高密度布板)

二、主要特性与优势

  • 高体积效率:47 nF 在 0201 体积下提供较大的容值,适合空间受限的移动设备与便携终端。
  • 温度稳定性适中:X5R 介质在常见工作温度范围内保持较稳定的容值,适合去耦、滤波等一般电源/信号用途。
  • 低等效串联电阻/电感(ESR/ESL):小封装和多层结构使其在高频去耦与旁路应用中表现良好。
  • 可靠性与批量可得性:村田为主流厂商,具有成熟的制造与质量控制体系,适合量产应用。

三、典型应用场景

  • 电源去耦与旁路:与电压调节器、PMIC、控制芯片相配合,抑制高频噪声。
  • 模拟/数字滤波:输入/输出滤波、抗混叠与稳压回路中的耦合/滤波元件。
  • 移动设备与穿戴设备:适合手机、蓝牙耳机、手表等对体积与重量敏感的产品。
  • 高频电路中的旁路与阻抗匹配场合。

四、设计与装配注意事项

  • 直流偏置效应:X5R 类陶瓷电容在施加直流电压时会出现容值下降,设计时应在目标工作电压下确认实际有效电容,必要时做补偿或选择更高额定电压/不同介质。
  • 温漂与频率特性:X5R 在温度和频率变化下的容值会波动,关键滤波或精密定时电路应评估其影响;若需要高稳定性考虑 C0G/NP0。
  • 焊接兼容性:适用于无铅回流焊工艺,遵循厂商推荐的回流温度曲线与焊盘设计。
  • 机械应力敏感性:0201 小尺寸器件在印制板弯曲、强力手工焊接或不当浸焊情况下易发生裂纹,布板与加固工艺(如加装阻焊、避免过孔靠近焊盘)需注意。
  • 贴装与回流:建议按照村田的推荐焊盘尺寸与回流曲线设计 PCB,可以降低开裂和虚焊风险。

五、可靠性与存储

  • 存储:保持干燥包装,避免长时间潮湿暴露;若开盘后存放需按湿敏等级(若适用)进行回流前干燥处理。
  • 可靠性:符合常规 MLCC 工艺制造与检测,适合消费电子与工业级量产;关键应用建议参考村田完整规格书中的寿命与老化测试数据。

六、采购与替代建议

  • 订购时以完整料号 GRM033R61C473KE84D 下单,注意包装卷装数量与生产批次。
  • 若需更高温度稳定性或更小偏置效应,可考虑容值相近的 C0G/NP0 产品或更高额定电压的 X5R/ X7R 产品。
  • 同类替代可在 TDK、KEMET 等主流厂商中寻找相同性能与封装型号,但需核对 DC-bias、温漂及机械尺寸以确保互换性。

如需具体焊盘建议、回流曲线或在目标工作电压下的 DC-bias 曲线,可提供 PCB 要求与工作条件以便给出更精确的设计建议。

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