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muRata GRM0335C1H3R0BA01D
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GRM0335C1H3R0BA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H3R0BA01D
- Electronic Component
- 1
- Electronic Component
- 3pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0252997554
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1H3R0BA01D 产品概述
一、产品简介
GRM0335C1H3R0BA01D 为村田（muRata）制造的一款贴片多层陶瓷电容（MLCC），标称容量 3 pF，额定电压 50 V，温度系数 C0G（又称 NP0），封装为 0201。该器件以体积小、温度特性稳定、损耗低著称，适用于高频与高精度电路中的耦合、匹配与定时应用。
二、主要性能与特点
- 温度特性极佳：C0G（NP0）介质材料接近零温度系数，温度稳定性优异，适合对电容随温度变化敏感的电路。
- 低损耗、低寄生：介质损耗小，ESL/ESR 较低，适用于射频路径、滤波与匹配网络。
- 小型封装：0201（约 0.6 mm × 0.3 mm）实现高密度贴装，节省 PCB 面积。
- 额定电压 50 V，适合多数信号级与低电压模拟场合使用。
三、电气与机械要点
- 标称容量：3 pF；温度系数：C0G；额定电压：50 V。
- 封装特性：0201 小尺寸便于高密度布板，但对贴装、回流与检测要求较高；实际外形尺寸与厚度请参考村田官方数据手册以确保兼容性。
- 对直流偏压的稳定性好：相比高介电常数（如 X7R、X5R）材料，C0G 几乎没有 DC 偏压引起的容量变化。
四、使用与布局建议
- 尽量靠近信号源或地端贴放，连接走线长度最短以降低寄生电感与噪声耦合。
- 高频或射频路径推荐配合地线过孔（via stitching）和合理阻抗控制布线。
- 对关键匹配或滤波网络，避免与大型铜箔或热源直接相连以减少热应力影响。
- 采用符合推荐回流曲线的焊接工艺，开封后按厂商防潮等级（MSL）要求处理，必要时在回流前进行烘烤除湿。
五、典型应用场景
- 射频前端的匹配与旁路电容（如滤波、耦合、阻抗匹配）。
- 高稳定性振荡器、定时与采样电路中的定容元件。
- 精密模拟电路与测量仪器中需保持容量稳定的场合。
- 高密度移动与便携设备的信号路径优化。
六、可靠性与选型建议
- 对可靠性有严格要求的应用，建议参考村田官方寿命与应力测试数据（热冲击、机械冲击、回流耐受等）。
- 若对板上应力、焊接工艺或长期漂移有顾虑，可考虑选用略大封装或更高电压等级的同系列产品以提高裕量。
- 可在相同参数下比较其他厂商（如 TDK、京瓷等）相似 C0G 0201 规格作为备选，但注意各厂商对 0201 的几何尺寸与焊盘推荐可能存在差异。
如需进一步的规格表、回流曲线或 PCB 焊盘建议，请提供具体应用场景或允许查询村田最新版数据手册，我可协助提取关键参数与设计参考。
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