WMSIC Electronic Components

muRata GRM155R72A102KA01D

ModelGRM155R72A102KA01D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM155R72A102KA01D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM155R72A102KA01D
Electronic Component
1
Electronic Component
1nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0227656433
Electronic Component
X7R
Voltage
100V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM155R72A102KA01D(村田)产品概述

一、产品简介

GRM155R72A102KA01D 是村田(muRata)生产的一款多层陶瓷电容(MLCC),封装为 0402(公制 1005),标称容量 1nF(102),额定电压 100V,介质类型 X7R,公差 ±10%,适用于表面贴装应用。该型号在尺寸小、稳定性好与高电压耐受之间取得均衡,常用于滤波、旁路、耦合和高密度 PCB 设计中。

二、主要电气与热学参数

  • 容值:1 nF(±10%)
  • 额定直流电压:100 V DC
  • 介质:X7R(-55°C 至 +125°C,温度变化下容量允许变化 ≤ ±15%)
  • 封装:0402(约 1.0 × 0.5 mm)SMD
  • 极性:无(非极性)
  • 损耗角正切(DF)、漏电流、等效串联电阻(ESR)等随频率与温度变化,X7R 属中等介电常数材料,综合损耗低于高K材料但高于 NP0/C0G。

三、特性与设计注意事项

  • DC bias(电压依赖性):X7R 在施加直流偏压时容量会下降,尤其在较高电压下需考虑实际电路中有效容量比标称值降低,设计时建议留足裕量或在样机上实测。
  • 温度特性:X7R 在指定温区内保证容量变化范围,但仍存在温漂,若需高稳定性或高 Q,应选 NP0/C0G。
  • 机械可靠性:0402 尺寸对焊接热与焊膏量敏感,手工/回流焊不当容易产生裂纹。建议遵循厂商贴装与回流曲线。
  • 自愈性与可靠性:陶瓷电容无极性、绝缘电阻高、寿命长,适合一般商规与工业级应用;如需汽车级可靠性,请确认是否满足 AEC‑Q200 标准。

四、典型应用

  • 去耦与旁路:数字电源与模拟电源局部去耦、抑制高频噪声。
  • 滤波与耦合:音频/射频前端的低中频滤波、电平耦合电容(注意温漂与非线性)。
  • 定时/谐振场景:对精度要求不高的定时或频率补偿电路。
  • 高压小容量场合:如开关电源次级滤波、脉冲应用等(注意 DC bias 与击穿裕量)。

五、封装、焊接及存储建议

  • 焊接:遵循村田推荐的回流焊曲线,避免超过规定峰值温度与长时间高温,使器件受热均匀。
  • PCB 设计:参考厂方推荐焊盘尺寸与焊膏量,减小应力集中以降低焊后裂纹风险。
  • 存储与搬运:防潮防尘,避免机械冲击与弯曲 PCB 导致应力集中。大批量使用时按卷盘(tape & reel)流程存放。

六、选型与替代建议

  • 若需更高温度稳定性/低损耗,请考虑 NP0/C0G 系列。
  • 若空间允许且需更高容值或更小 DC bias,则可选较大封装或不同介质(如 X5R/高K),但需权衡体积与性能。
  • 同类替代可查找 TDK、Yageo、KEMET 等厂商的 0402 / 1nF / 100V / X7R 产品,选型时比对 DC bias 曲线、尺寸、可靠性验证与报价。

七、结论

GRM155R72A102KA01D 以其 0402 的小尺寸、100V 的电压等级与 X7R 的通用温度特性,适合对体积敏感且需中高压小容量的滤波与旁路应用。设计时重点关注 DC bias、回流焊工艺和 PCB 应力管理,必要时参考村田官方数据手册与样品实测以确保电路性能满足需求。

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