WMSIC Electronic Components

MICROCHIP MCP9701AT-E/TT MCP9701AT

ModelMCP9701AT-E/TT
PackageSOT-23
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MCP9701AT-E / TT
Type
MICROCHIP
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MCP9701AT-E/TT
Electronic Component
1
Package
SOT-23
Electronic Component
Temperature Sensor
Electronic Component
±2℃
Electronic Component
0.042g
Electronic Component
1
Electronic Component
BM0264875677
Operating Voltage
3.1V~5.5V
Electronic Component
10℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCP9701AT-E/TT 产品概述

一、产品简介

MCP9701AT-E/TT 是美国微芯科技(Microchip Technology Inc.)公司推出的一款高性能温度传感器。这款温度传感器采用先进的模拟技术,能够提供线性化的输出电压,方便与各种电子设备进行集成。MCP9701AT-E/TT 设计用于广泛的温度监测和控制应用,具有高精度和出色的温度感应能力。

二、技术参数

  • 传感器类型:模拟,本地
  • 温度感应范围:-10°C 至 125°C
  • 输出类型:模拟电压,线性输出
  • 供电电压范围:3.1V 至 5.5V
  • 分辨率:19.5mV/°C
  • 最高精度:±2°C(在-2°C 至 +4°C 范围内)
  • 工作温度范围:-40°C 至 125°C
  • 安装类型:表面贴装型(SMD)
  • 封装规格:SOT-23-3,TO-236-3,SC-59
  • 特殊条件下的测试范围:0 °C 至 70 °C(-10°C 至 125°C)

三、产品特点

  1. 高精度:MCP9701AT-E/TT 在工作过程中展现了 ±2°C 的高精度,这意味着其输出的温度值相对真实温度的偏差非常小,增强了其在精确温控及监测应用中的可靠性。

  2. 宽温范围:该传感器能够在-40°C 至 125°C 的广泛温度范围内稳定工作,适用于极端环境条件,涵盖了大多数工业和消费类电器的需求。

  3. 简单的接口:作为一款模拟输出的温度传感器,MCP9701AT-E/TT 提供直观的电压输出信号,使其在PCB设计布局方面极为方便,用户只需通过简单的电压转换即可获得相应的温度值。

  4. 表面贴装设计:采用 SOT-23-3 封装,使MCP9701AT-E/TT 在电路板上的占板面积相对较小,适合空间受限的应用场合,可以方便地集成到各种电子设备中。

  5. 成本效益:与数字温度传感器相比,模拟传感器通常具有更低的成本和更少的复杂度。MCP9701AT-E/TT 将是温度监测系统中的经济高效选择。

四、应用领域

MCP9701AT-E/TT 可广泛应用于众多领域,包括但不限于:

  • 家用电器:如微波炉、冰箱和空调等设备中的温度监测。
  • 工业控制:在各类工业设备和自动化系统中,作为温度反馈元件,进行精准控制。
  • 消费电子:例如,智能手机、平板电脑和配件的温度调节。
  • 医疗设备:在医用温度监测设备中进行监控。
  • 气候监测:为气象站和环境监测设备提供准确的温度读数。

五、总结

MCP9701AT-E/TT 作为一款小型、高精度的模拟温度传感器,具有优异的性能和广泛的应用潜力。其简单的电气接口和宽广的温度测量范围,使其在各种应用场景中脱颖而出。无论是需要精准的环境监测,还是普通的设备温控,MCP9701AT-E/TT 都是理想的温度感应解决方案。通过其先进的设计及高性价比,微芯科技无疑为工程师和设计师提供了一款高效的温度传感器选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.