Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
25LC640AT-I/SN 为 Microchip(美国微芯)推出的串行 SPI EEPROM,容量 64Kbit(8K x 8)。器件工作电压范围宽(2.5V ~ 5.5V),支持典型 SPI 时钟频率至 10 MHz,工作温度范围为 -40℃ 到 +85℃,封装为标准 SOIC-8,适合工业级嵌入式存储应用。
SOIC-8 封装提供标准 8 引脚布局,包含 CS(片选)、SI/MOSI、SO/MISO、SCK、WP、HOLD、VCC、VSS。具体引脚编号与功能请参阅器件数据手册以确保设计一致。
器件具备行业级温度范围与长期数据保持能力(TDR 约 200 年),写入耐久度高达百万次,适合需长期可靠保存关键数据的工业应用。更多认证、ESD 与封装可靠性信息,请参考 Microchip 官方数据手册与应用说明。
总结:25LC640AT-I/SN 以其宽电源范围、工业温度等级、耐久的写入寿命及超长数据保持特性,为需要小容量、可靠非易失性 SPI 存储的系统提供了一种成熟可靠的解决方案。在硬件布局与软件驱动设计上遵循数据手册建议即可获得稳定性能。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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