WMSIC Electronic Components

MICROCHIP TCM809SVNB713

ModelTCM809SVNB713
PackageSOT-23
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP TCM809SVNB713
Type
MICROCHIP
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
TCM809SVNB713
Electronic Component
1
Package
SOT-23
Electronic Component
Supervisorand positions IC
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0230805405
Reset
140ms
Operating Temperature
40℃~+125℃
Operating Voltage
1V~5.5V
ICType
Voltage Supervisor
Output Type
Electronic Component
Voltage
4.63V
Supervisor Voltage
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TCM809SVNB713 产品概述

一、产品简介

TCM809SVNB713 是 Microchip(美国微芯)出品的一款单通道电压监控与复位芯片,采用 SOT-23 小封装,适用于对单一路电源进行可靠的上电复位与低电平复位监控。器件工作电压范围为 1.0 V 至 5.5 V,复位为低电平有效(RESET#),输出为推挽驱动,标准复位脉冲宽度约为 140 ms,工作结温范围为 -40 ℃ 至 +125 ℃,适配工业级温度要求。

二、主要特性

  • 监控通道:1 路被监控电压输入(VCC 监控)
  • 阈值电压:本型号阈值为 4.63 V(同系列还提供其它阈值选项以适配不同电压轨)
  • 输出类型:推挽输出(推高/拉低均能驱动),无需外部上拉电阻
  • 复位极性:低电平有效(RESET 引脚在 VCC 低于阈值时被拉低)
  • 复位保持时间:典型 140 ms(上电或欠压事件恢复时保证最小复位时间)
  • 电源范围:1.0 V ~ 5.5 V,便于在单节锂电池及常见逻辑电源系统中使用
  • 封装:SOT-23,体积小,便于空间受限应用的 PCB 布局
  • 温度范围:-40 ℃ ~ +125 ℃(Tj),满足工业级可靠性要求

三、功能与工作原理

TCM809SVNB713 在电源上电或电压下降时持续监测 VCC。一旦被监控电压低于内部设定阈值(4.63 V),器件将把复位输出(RESET#)拉低,强制被监控系统进入复位状态;当电压回升并稳定高于阈值后,器件在内部延时(约 140 ms)后释放复位,确保被监控系统有足够时间完成上电初始化。由于输出为推挽结构,可直接驱动目标芯片的复位脚或外部逻辑,无需外部上拉,提高系统简洁性和响应可靠性。

四、典型应用场景

  • 微控制器(MCU)系统的电源监控与上电复位
  • 便携式与电池供电设备(如 IoT 终端、便携式仪表)
  • 电源管理与电压轨保护、系统级电源顺序控制
  • 工业控制与嵌入式系统需要宽温度和高可靠性的场合

五、设计注意事项

  • 阈值选择:选型时应确认系统的工作电压和允许的最低工作电平,选择与之匹配的阈值型号(本型号为 4.63 V,若使用 3.3 V 或其它电压轨,请选择相应阈值版本)。
  • 输出连接:由于为推挽输出,可直接连接至 MCU RESET 引脚;若与多个负载并联,请考虑驱动能力与总线容量。
  • 去耦与布局:为保证稳定监测与避免误触发,VCC 引脚附近应放置合适的旁路电容(例如 0.1 µF 陶瓷),并在 PCB 布局上尽量缩短 VCC/GND 回流路径。
  • 温度与容差:注意阈值随温度和器件公差的漂移,关键应用可参考器件数据手册中的最低/最高触发电压与温度系数指标。
  • 无手动复位/看门狗:本器件不提供手动复位按键或看门狗功能,如需这些功能需外部电路或选用带相应功能的监控器件。

六、总结

TCM809SVNB713 以其宽电压范围、推挽输出、低电平有效复位以及 140 ms 的可靠复位保持时间,为需要稳定上电复位和欠压保护的电子系统提供了简洁而可靠的解决方案。其 SOT-23 小封装和工业级温度适应能力,使其非常适合空间受限且对可靠性要求较高的便携与嵌入式应用。在设计中合理匹配阈值并注意去耦与布局,可充分发挥该器件在系统复位管理中的作用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.