Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MCP809T-300I/TT 是 MICROCHIP(美国微芯)推出的一款低功耗电压监控与复位芯片,面向对电源可靠性有较高要求的微控制器和数字系统。器件在电源电压低于设定阈值时产生低电平有效的复位信号(RESET),并在电源恢复后保持固定的复位延时,确保系统完成上电初始化。推挽输出结构可直接驱动目标器件的复位引脚,无需外部上拉电阻,适合电池供电和便携式应用。
MCP809T-300I/TT 通过内部精密比较电路监测 VDD 电压。当 VDD 低于 2.925 V 时,器件将复位输出拉低,进入复位态;当 VDD 回升并稳定在阈值以上时,内部定时器开始计时,持续约 350 ms 的复位超时期间仍保持低电平,超时结束后复位输出释放(高电平),允许系统正常运行。若在超时时间内 VDD 再次跌落至阈值以下,定时器将重新复位计时并保持复位输出低电平。
推挽输出意味着器件既能向外驱动高电平也能拉低输出,免去了外部上拉的需要,能提供更确定的电平驱动能力。
器件以 SOT-23-3 小体积封装提供,适合空间受限的 PCB 设计。常见使用方式为三引脚:VDD(供电)、GND(地)和 RESET(复位输出,低电平有效)。具体的引脚排列请参照厂商数据手册以确保焊盘和布局正确。
总结:MCP809T-300I/TT 是一款针对 3 V 级别系统优化的、低功耗且易于集成的电压监控与复位芯片。其精确阈值、350 ms 的固定复位保持时间以及推挽输出特点,使其在便携式和嵌入式应用中能够提供可靠的上电复位与欠压保护。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products