WMSIC Electronic Components

MICROCHIP 24LC1025T-I/SM 24LC1025T

Model24LC1025T-I/SM
PackageSOIC-8-208mil
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP 24LC1025T-I / SM
Type
MICROCHIP
Minimum package
2100 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
24LC1025T-I/SM
Electronic Component
1
Package
SOIC-8-208mil
Electronic Component
EEPROM
Electronic Component
1.7g
Electronic Component
1
Electronic Component
BM0228536598
Electronic Component
1Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.5V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
400kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

24LC1025T-I/SM 产品概述

一、产品简介

Microchip 24LC1025T-I/SM 是一款高可靠性的串行 EEPROM,容量 1 Mbit(128 Kbyte),采用标准 I2C(两线)接口,适用于工业级环境。器件工作电压范围宽(2.5V~5.5V),支持高达 400 kHz 的 I2C 时钟速率,工作温度范围为 -40℃ 至 +85℃,并以 SOIC-8-208mil 封装供货,便于在多种 PCB 布局中替换或开发使用。

二、主要参数概览

  • 品牌:MICROCHIP(美国微芯)
  • 型号:24LC1025T-I/SM
  • 接口类型:I2C(两线串行总线)
  • 存储容量:1 Mbit(128 Kbyte)
  • 工作电压:2.5V ~ 5.5V
  • 时钟频率(fc):最高 400 kHz
  • 写周期时间(Tw):典型 5 ms(写入完成需等待)
  • 写周期寿命(擦写耐久):1,000,000 次
  • 数据保存(TDR):200 年(典型)
  • 工作温度范围:-40℃ ~ +85℃
  • 封装:SOIC-8-208mil

三、关键特性与优势

  • 宽电压工作区间(2.5V~5.5V),便于与不同逻辑电平系统兼容,减少外部电平转换需求。
  • 支持标准 I2C 时钟(100 kHz)和快速模式(400 kHz),满足多数系统对速度和总线带宽的要求。
  • 极高的数据可靠性:长期数据保留(200 年)与百万级写入寿命,适合需要长期保存标识、校准常数或固件参数的应用。
  • SOIC-8 封装利于手工焊接与自动化贴装,适合样机验证及量产。

四、典型应用场景

  • 工业控制器与现场设备的参数存储与日志记录。
  • 仪器校准数据与序列号、配置表存储。
  • 消费与通讯设备中需要非易失性存储的场合(固件补充、用户设置)。
  • 汽车电子(在符合工作温度与系统级可靠性设计下)与医疗设备辅助存储。

五、封装与引脚注意事项

SOIC-8-208mil 封装尺寸常用于 DIP 替代与标准化生产工艺。器件在 PCB 布局时应注意电源旁路电容的放置(靠近 VCC 引脚),同时为 I2C 总线预留合适的上拉电阻值以保证通信稳定。若使用写保护(WP)或地址引脚(视具体封装版本),请参考数据手册确认连接方式。

六、设计与使用建议

  • 写操作完成前请遵循 Tw(约 5 ms)时序,或通过器件应答轮询(ACK)判断写入完成状态以避免数据冲突。
  • 为延长器件寿命,避免对同一地址进行频繁无谓写入,必要时采用磨损均衡策略或缓存机制。
  • 在多从机 I2C 总线中正确配置地址线和电气特性,防止地址冲突。
  • 电源瞬态和复位时需确保 EEPROM 电源稳定,推荐使用 0.1 μF 陶瓷旁路电容。

七、采购与质量保证

作为 Microchip 系列产品,24LC1025T-I/SM 在微芯全球供应链中有成熟的质量控制与生命周期管理。采购时请确认包装标识与批号,必要时可索取器件数据手册与可靠性报告以支持系统级认证与长期维护。

如需进一步的电气时序图、引脚排列或样机评估建议,可提供具体设计需求,我会给出更详尽的实现方案与注意事项。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.