WMSIC Electronic Components

MICROCHIP MIC5319-3.3YD5-TR MIC5319

ModelMIC5319-3.3YD5-TR
PackageTSOT-23-5
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MIC5319-3.3YD5-TR
Type
MICROCHIP
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
200mV@(500mA)
Electronic Component
MICROCHIP
Electronic Component
40uVrms
Electronic Component
MIC5319-3.3YD5-TR
Electronic Component
1
Package
TSOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.06g
Electronic Component
1
Features
Terminal Block
Electronic Component
BM0228151880
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MIC5319-3.3YD5-TR 产品概述

一、产品简介

MIC5319-3.3YD5-TR 是 MICROCHIP(美国微芯)推出的一款高性能线性稳压器(LDO),固定输出 3.3V、单路输出,采用 TSOT-23-5 封装并以卷带方式(-TR)供货。该器件旨在在低压差和低静态电流条件下提供高达 500mA 的稳流能力,适合电池供电及对噪声和电源抑制要求较高的便携、电信及工业应用。

二、主要性能亮点

  • 固定输出:3.3V,输出极性为正极。
  • 最大输出电流:500mA(连续)。
  • 最低压差(Dropout):典型 200mV @ 500mA,适合低压差应用。
  • 静态电流 Iq:90 µA(典型),有利于低功耗系统。
  • PSRR:70 dB @ 1 kHz,优异的电源纹波抑制能力。
  • 噪声:40 µVrms,适合对模拟或敏感数模混合电路的供电。
  • 工作输入电压:最高 5.5V(器件工作范围及限制见数据手册)。
  • 工作结温:-40°C ~ +125°C(Tj)。

三、功能与保护

  • 使能功能(EN):器件带使能引脚,可用于上电复位、功耗管理及电源域控制(具体使能电平和时序请参考数据手册)。
  • 过流保护:内部限流设计,提供输出过流情况下的保护与恢复特性。
  • 过热保护:内置热关断,当结温超过阈值时自动关断以防损坏,温度恢复后自动重启。

四、典型电气参数(关键取值)

  • 输出电压:3.3V(固定型,出厂校准)。
  • 输出最大电流:500mA。
  • 压差(Vdrop):约 200mV @ 500mA(实际值随温度和输入电压略有变化)。
  • 静态电流:约 90 µA(无负载时)。
  • PSRR:≈ 70 dB @ 1 kHz。
  • 输出噪声:≈ 40 µVrms。
    (更多精确典型曲线与极限值请参照官方数据手册)

五、外部器件与布局建议

  • 输入/输出电容:建议在输入端放置 1 µF ~ 10 µF 低 ESR 陶瓷电容,输出端建议使用 2.2 µF ~ 10 µF 低 ESR 陶瓷电容以保证稳态稳定性与瞬态响应。具体电容值和 ESR 范围以数据手册给出的稳定性条件为准。
  • 布局要点:输入电容与输出电容尽量靠近器件引脚放置,走短粗铜迹;使能引脚的驱动路径避免长走线与噪声耦合;给地引脚及散热焊盘尽可能提供充足的铜面积以提高散热能力。
  • 旁路与滤波:若系统对超低噪声或超高 PSRR 有更高要求,可在输入端加入适当 RC 滤波或在输出加入额外的去耦网络,但需验证稳压器的稳定性。

六、热设计与可靠性

线性稳压器的功耗与输入输出电压差成正比:Pd = (Vin - Vout) × Iout。在大电流或较高 Vin 情况下须关注结温上升。TSOT-23-5 封装的散热能力有限,建议在 PCB 上增加散热铜面积(底层大地平面或散热焊盘)并按实际工况进行结温计算与热仿真,确保在最大环境温度下不超过 Tj 最大允许值。

七、典型应用场景

  • 便携设备、便携式传感器与数据采集模块的 3.3V 供电。
  • MCU、FPGA 或射频前端等对噪声与 PSRR 有要求的敏感电路电源。
  • 电池供电系统、USB 外设电源管理与工业控制模块的局部稳压。

八、封装与订购信息

  • 封装:TSOT-23-5。
  • 订购号示例:MIC5319-3.3YD5-TR(尾部 -TR 表示卷带包装,便于贴片生产线使用)。
  • 其他型号说明:如需不同输出电压或散装/盘装形式,请参考 Microchip 产品系列与物料表。

备注:本文为器件概要性介绍,设计与验证时请以 Microchip 官方数据手册与应用说明为准,特别是使能电平、最大绝对额定值、外部电容稳定性条件及热阻参数。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.