WMSIC Electronic Components

MICROCHIP PIC16F627A-I/SO PIC16F627A

ModelPIC16F627A-I/SO
Package18-SOIC
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP PIC16F627A-I / SO
Type
MICROCHIP
Minimum package
4200 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
PIC16F627A-I/SO
Electronic Component
1
Package
18-SOIC
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.795g
CPU
8 Bit
CPU
PIC
I / O
16
RAM
224Byte
Electronic Component
1
EEPROM
128Byte
Features
(BOR / LVD / LVR / LVI); positions(POR); Gate positions; Built-in General Purpose
Electronic Component
BM0264240611
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PIC16F627A-I/SO 产品概述

一、产品简介

PIC16F627A-I/SO 是来自 MICROCHIP 的经典 8 位单片机,面向成本敏感且对外围资源要求不高的嵌入式控制应用。器件采用 18 引脚 SOIC 封装(300 mil),工作电压宽(3.0V~5.5V),工作温度范围 -40℃~+85℃,适合工业级与消费类产品的控制与测量场景。

二、主要规格

  • CPU 内核:PIC 8 位
  • 最大主频:20 MHz
  • 程序存储器:FLASH,容量约 1.75 KB
  • 数据 RAM:224 Byte
  • EEPROM:128 Byte
  • 通用 I/O:16 路
  • 振荡器类型:内置振荡器(可实现最高 20MHz 运行)
  • 工作电压:3.0V ~ 5.5V
  • 工作温度:-40℃ ~ +85℃
  • 封装:18-SOIC(SOP-18-300mil)
  • 品牌:MICROCHIP(美国微芯)

三、功能特性

  • 完善的复位与电源监控:上电复位(POR)与欠压检测(BOR/LVD/LVR/LVI)保证电源异常时可靠复位;
  • 看门狗定时器(WDT):用于系统出错自动恢复,适合要求高可靠性的应用;
  • 内置通用定时器:支持定时、计数和事件触发功能,便于实现 PWM、时间控制等功能;
  • 程序存储采用 FLASH,可在系统开发阶段方便在线编程与固件升级;
  • 较丰富的 I/O 与片上资源,满足小型自动化、家电控制、传感器接口等应用。

四、封装与引脚注意事项

18 引脚 SOIC 封装占板面积小,便于在体积受限的电路中使用。设计时请注意焊盘热量管理及旁路去耦,常见建议:

  • VDD/VSS 处并联 0.1 µF 陶瓷旁路电容,靠近芯片电源脚;
  • 对于对复位要求严格的系统,配合外部复位电路或滤波以提高抗干扰能力;
  • 外接时钟或外部器件时注意 I/O 分配与电平兼容。

五、典型应用与设计建议

适用于小家电控制、简单通信协议实现、人机界面按键扫描、传感器数据采集、教育开发板等场景。设计建议:

  • 充分利用片内 EEPROM 做参数存储,减少外部存储器;
  • 启用 BOR/WDT 等保护功能以提高系统鲁棒性;
  • 开发阶段使用支持的编程工具进行在系统烧写与调试,量产时考虑编程夹具与器件识别策略。

六、采购与兼容性注意

MICROCHIP 品牌原装器件品质与文档支持较好,选型时确认封装和温度等等级(I 表示工业级)。如需替代器件,请对比程序容量、RAM/EEPROM 容量、I/O 数量与外围功能,以确保固件兼容性与系统性能满足要求。

以上为 PIC16F627A-I/SO 的简明产品概述,便于快速理解器件能力与典型设计注意事项。如需更详细的电气参数、引脚排列或参考电路,可进一步查阅官方数据手册或提出具体需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.