WMSIC Electronic Components

MICROCHIP MCP23008T-E/ML MCP23008T

ModelMCP23008T-E/ML
PackageUQFN-20-EP(4x4)
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MCP23008T-E / ML
Type
MICROCHIP
Minimum package
3300 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MCP23008T-E/ML
Electronic Component
1
Package
UQFN-20-EP(4x4)
Electronic Component
I / O Expander
Electronic Component
0.15g
Electronic Component
1
I / O
8
Features
positions; and
Electronic Component
BM0264469171
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~5.5V
Interface Type
I2C
Clock Frequency(fc)
1.7MHz
Static Current(Iq)
2uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCP23008T-E/ML 产品概述

一、概述

MCP23008T-E/ML 是 Microchip 提供的一款 8 位 I²C I/O 扩展器,采用 UQFN-20-EP (4×4 mm) 封装,专为需要在有限 MCU 引脚下扩展数字 I/O 的应用设计。器件工作电压为 4.5V~5.5V,工作温度范围宽(-40℃~+125℃),并具备低静态电流(Iq ≈ 2 μA)与中断输出,适合工业级与车规边缘应用中对可靠性、低功耗和总线扩展性的需求。

二、主要规格参数

  • 接口类型:I²C,总线时钟频率 fc = 1.7 MHz(支持高速 I²C 应用)
  • 可用 I/O 数量:8 路通用数字 I/O
  • 中断输出:器件提供中断引脚,用于生成外设状态变化的中断通知
  • 地址扩展:支持级联与地址扩展,最多可并联 8 个 设备以扩展更多通道
  • 复位功能:内置/外部复位机制,方便系统初始化与故障恢复
  • 静态电流:Iq = 2 μA(典型,利于低功耗运行)
  • 工作电压:4.5V ~ 5.5V(兼容 5V 系统)
  • 工作温度:-40℃ ~ +125℃
  • 封装:UQFN-20-EP (4×4 mm)

三、功能特性

  • 通过 I²C 总线实现对 8 路 IO 的读写与配置,减小主控引脚占用。
  • 支持器件级地址选择,通过地址引脚实现最多 8 台器件并联,便于级联扩展系统 IO。
  • 提供中断输出,可在端口电平变化时触发中断,降低 MCU 轮询开销,提高响应效率。
  • 具有复位功能,便于上电或异常恢复到已知状态。
  • 低静态电流设计,适合对能耗敏感的系统。

四、典型应用

  • MCU/MPU GPIO 扩展:用于键盘矩阵、按键输入、拨码开关扫描等。
  • 人机界面控制:驱动指示灯、背光控制、状态监测等。
  • 工业控制与测量:在工业控制柜或传感器节点中扩展数字 I/O。
  • 汽车与车载设备:宽温工作与 5V 兼容使之适用于车载电子模块(须满足车规认证要求)。
  • 电源管理与远程开关:配合中断实现低功耗唤醒控制。

五、设计与布局要点

  • 电源与去耦:在电源引脚附近放置 0.1 μF 陶瓷去耦电容,靠近器件接地焊盘。
  • I²C 总线:SDA/SCL 需外部上拉电阻;高速 1.7 MHz 下选择合适阻值与布线以保证信号完整性。总线长度与并联设备数量会影响上拉选择与时序。
  • 中断线:若中断输出为开漏,请在主控侧提供上拉电阻并考虑中断极性与消抖处理。
  • 地址引脚:在级联多器件时,确保地址引脚可靠拉高/拉低以避免地址冲突。
  • 封装热垫:UQFN-EP 的中间焊盘需焊接良好以保证散热与接地完整性,过孔设计需参照厂商推荐。

六、封装与采购建议

  • 封装型号:UQFN-20-EP (4×4),适合空间受限的表贴应用,注意回流工艺与焊盘设计。
  • 采购注意:选择正规渠道购买以确保器件真伪与批次一致性,关注器件温度等级与供货文件(Datasheet、封装图与推荐 PCB land pattern)。

以上为 MCP23008T-E/ML 的简明产品概述与设计要点,适合在需要 5V 兼容、低功耗且可扩展数字 I/O 的场景中作为首选 I²C 扩展方案。若需更详细的寄存器定义、时序规范或参考电路图,请参考 Microchip 官方 Datasheet 与应用手册。

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