WMSIC Electronic Components

MICROCHIP TC2117-3.3VDBTR TC2117

ModelTC2117-3.3VDBTR
PackageSOT-223
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP TC2117-3.3VDBTR
Type
MICROCHIP
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
450mV@(800mA)
Electronic Component
MICROCHIP
Electronic Component
TC2117-3.3VDBTR
Electronic Component
1
Package
SOT-223
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.25g
Electronic Component
1
Electronic Component
BM0257562116
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
6V
Output
Electronic Component
Output Voltage
3.3V
Output Current
800mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC2117-3.3VDBTR 产品概述

一、主要特性与技术规格

TC2117-3.3VDBTR 是 MICROCHIP 提供的一款固定输出线性稳压器,面向中高电流点对点稳压场合。主要参数如下:

  • 输出电压:3.3V(固定)
  • 最大输出电流:800 mA
  • 工作电压(典型输入):6V(可按系统设计留有裕量)
  • 压差(Dropout):450 mV @ 800 mA
  • 静态电流(Iq):80 μA(低静态电流,适合低功耗应用)
  • 电源纹波抑制比(PSRR):55 dB @ 1 kHz
  • 保护功能:过流保护(自动限制)
  • 工作结温:-40 ℃ ~ +125 ℃(Tj)
  • 输出极性:正极输出,单通道
  • 封装:SOT-223

二、性能亮点与设计优势

  • 低压差:450 mV 的压降在大电流工作时依然保持较小的头部空间,适合输入电压接近 3.3V 的场合。
  • 低静态电流:80 μA 的待机耗流对电池供电或节能系统友好。
  • 良好的 PSRR(55 dB @ 1 kHz):对开关电源后级滤波、模拟电路和敏感模数前端有明显抑制效果。
  • 集成过流保护:简化系统保护设计,提高可靠性。
  • 宽温度范围:适合工业级环境使用。

三、典型应用场景

  • 嵌入式单板供电(MCU、FPGA 或外设的 3.3V 轨)
  • 传感器及数据采集前端电源管理(受益于较高 PSRR)
  • 电池供电或便携设备的后级稳压
  • 开关电源后的线性后置滤波器,用于降低噪声与纹波
  • 工业与消费电子需稳定 3.3V 的场合

四、热设计与 PCB 布局建议

  • 功耗估算:Pd ≈ (Vin − 3.3V) × Iout。举例:Vin = 6V、Iout = 0.8A 时,Pd ≈ 2.16W,需重视散热。
  • SOT-223 封装通过焊盘与大铜箔散热,建议在 PCB 上增加散热铜箔面积并使用若干过孔导入内部或背面铜层。
  • 输入、输出电容尽量靠近器件引脚布置,减小引线及寄生感抗。
  • 输出接地与系统地应布线合理,避免高电流回流经过敏感模拟地。

五、典型应用电路与注意事项

  • 必须配合适当的输入和输出去耦电容以保证稳态与瞬态性能。常见做法为输入端放置 1 μF ~ 10 μF 去耦,输出端推荐 10 μF 以上低 ESR 电容(陶瓷或钽电容,参考器件稳定性要求)。
  • 注意器件在大电流、高压差下会发热,推荐在 PCB 上做足铜箔并评估结温,必要时采用散热片或加强底层散热。
  • 系统设计中应预留软启动、短路保护及合理的启动顺序以保护负载与稳压器。

六、封装与采购与总结

  • 封装:SOT-223,便于手工焊接与中等功率散热。
  • TC2117-3.3VDBTR 适合需要 800 mA 输出、低静态电流、良好纹波抑制且对热设计有一定预案的应用。合理的 PCB 散热和电容选择是保证长期稳定工作的关键。若需更高效率或更严格热限控制,可考虑开关型 PMIC 与线性器件配合使用。

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