Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PIC16F877A-I/P 是由美国微芯科技(Microchip Technology)推出的一款高性能 8 位单片机(MCU),广泛应用于自动化控制、数据采集、仪器仪表和嵌入式系统等领域。该产品在功能、性能和稳定性方面均具备卓越的表现,是工业、通信及消费类电子产品设计的理想选择。
核心处理器:PIC系列处理器以其高度集成的架构而闻名,PIC16F877A 配备了一个 8 位 CPU 核心,支持高效的数据处理与运算。
工作频率与电源需求:本产品在供应电压范围为 4V 至 5.5V(Vcc/Vdd)内,最高处理速度可达到 20MHz,保证了快速响应能力和稳定性,适用于多种电源条件下运行。
内存规格:
输入/输出接口:PIC16F877A-I/P 提供高达 33 个 I/O 引脚,支持丰富的外设连接能力,包括 I²C、SPI 和 UART/USART 接口,为多种外部设备和传感器提供了便利的连接方式。
集成的外设功能:
环境适应性:PIC16F877A-I/P 的工作温度范围为 -40°C 至 85°C,适应各种极端环境,满足工业级应用的需要。
PIC16F877A-I/P 采用 40-PDIP(通孔插装)封装,便于手工焊接和自动化安装。该封装形式适合多种PCB(印刷电路板)的应用,为设计者提供了更大的灵活性。
PIC16F877A-I/P 被广泛应用于以下几个领域:
综上所述,PIC16F877A-I/P 作为一款高性能的 8 位单片机,凭借其强大的处理能力、丰富的外设支持和极佳的工作温度范围,成为许多电子设计方案中的首选。无论是在工业自动化还是消费类产品,我们都能看到它的身影,极大地推动了电子设计的创新与发展。选择 PIC16F877A-I/P,无疑是为项目提供了一个稳定、可靠且功能强大的解决方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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