WMSIC Electronic Components

MICROCHIP 11AA010T-I/TT 11AA010T

Model11AA010T-I/TT
PackageSOT-23
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP 11AA010T-I / TT
Type
MICROCHIP
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
11AA010T-I/TT
Electronic Component
1
Package
SOT-23
Electronic Component
EEPROM
Electronic Component
0.06g
Electronic Component
1
Features
Built-in Latch(WEL)
Electronic Component
BM0230057076
Electronic Component
1Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~5.5V
Interface Type
Bus
Electronic Component
100
Clock Frequency(fc)
100kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

11AA010T-I/TT 产品概述

一、产品简介

11AA010T-I/TT 是 MICROCHIP(美国微芯)推出的一款工业级 1Kbit 非易失性 EEPROM,采用 SOT-23 小封装,工作温度范围 -40℃ 至 +85℃,适合对体积、功耗与可靠性有较高要求的存储应用。器件以单总线接口进行通信,支持最高约 100kHz 的时钟频率,工作电压范围宽(1.8V~5.5V),便于在多种系统电源环境中直接使用。

二、主要规格参数

  • 存储容量:1Kbit(128 字节)
  • 接口类型:单总线(单线串行接口,最高时钟约 100kHz)
  • 工作电压:1.8V ~ 5.5V
  • 工作温度:-40℃ ~ +85℃(工业级)
  • 数据保留(TDR):200 年(典型)
  • 擦写/写入寿命:1,000,000 次(写周期寿命)
  • 单次写周期时间(Tw):约 5 ms
  • 封装:SOT-23
  • 品牌:MICROCHIP(美国微芯)

三、产品特点

  • 低电压宽范围:1.8V 起即可工作,适配低功耗与5V系统。
  • 超长数据保持与高耐久:典型 200 年数据保持,写周期高达百万次,适合长期配置与频繁更新场景。
  • 小尺寸封装:SOT-23 适合空间受限的移动、便携和嵌入式设备。
  • 简化通信:单总线接口降低引脚与布线复杂度,有利于系统简化与成本控制。
  • 工业级温漂:-40℃ 至 +85℃ 满足苛刻环境下的稳定性需求。

四、典型应用场景

  • 配置参数与校准数据存储(工业控制、传感器模组)
  • 产品序列号与身份认证信息保存(家电、通信设备)
  • 小容量日志或事件计数器(智能仪表、门禁)
  • 固件或系统设置的非易失性备份(嵌入式与消费类电子)

五、使用建议与设计要点

  • 电源与去耦:在器件 VCC 引脚近端放置 0.1μF 陶瓷去耦电容,降低电源瞬态对写操作的影响。
  • 总线拉高:单总线接口通常需外部上拉电阻,建议根据系统电压与线长选择合适阻值以兼顾速度与功耗。
  • 写入策略:由于单次写周期约 5 ms,应避免在频繁写入时阻塞主控,采用缓存或批量写入以减少总线占用并延长器件寿命;必要时做简单的磨损均衡(wear leveling)。
  • 时序与读写冲突:在写入期间避免发起新的读/写事务,待写完成后再进行访问,以确保数据一致性。
  • 封装与贴装:SOT-23 易于贴片生产,推荐按照厂商回流焊温度曲线处理并按 I/TT 带卷方式存储和上料。

11AA010T-I/TT 以其小型封装、宽电压、长数据保持与高写耐久性,适合用作工业与消费电子系统中关键配置和少量非易失性数据保存方案。

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