WMSIC Electronic Components

MICROCHIP MIC5353-3.3YMT-TR MIC5353

ModelMIC5353-3.3YMT-TR
PackageTMLF-6(1.6x1.6)
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MIC5353-3.3YMT-TR
Type
MICROCHIP
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
160mV@(500mA)
Electronic Component
MICROCHIP
Electronic Component
30uVrms
Electronic Component
MIC5353-3.3YMT-TR
Electronic Component
1
Package
TMLF-6(1.6x1.6)
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.013g
Electronic Component
1
Features
Terminal Block
Electronic Component
BM0265335145
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
6V
Output
Electronic Component
Output Voltage
3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MIC5353-3.3YMT-TR 线性稳压器(LDO)产品概述

一、核心定位与产品类别

MIC5353-3.3YMT-TR是美国微芯(Microchip)推出的固定输出型低压差线性稳压器(LDO),专为对功耗、封装尺寸及环境适应性要求较高的应用场景设计。该器件以3.3V为固定输出电压,最大负载电流达500mA,兼具宽温度范围、低噪声与多重保护特性,是工业控制、汽车电子、便携设备等领域的高效电源转换方案。

二、关键电气参数解析

该LDO的核心电气参数匹配中小功率供电需求,关键指标如下:

  • 输入输出特性:工作电压典型值6V,固定输出3.3V,可稳定驱动最大500mA负载,满足多数模拟/数字电路的供电要求;
  • 纹波抑制能力:电源纹波抑制比(PSRR)达60dB@1kHz,能有效衰减输入电源中的高频纹波,降低对传感器、射频模块等敏感电路的干扰;
  • 低压差性能:满载(500mA)时压差仅160mV,意味着输入电压略高于输出电压(如3.46V)即可稳定工作,适配电池放电后期等输入接近输出的场景;
  • 低功耗特性:静态电流(Iq)仅90μA,待机功耗极低,适合电池供电的便携设备或长期待机的物联网节点,可显著延长电池续航;
  • 低噪声输出:输出噪声为30μVrms(典型值),在宽频率范围内保持低噪声,满足医疗设备、音频电路等对噪声敏感的应用;
  • 温度适应性:工作结温范围为-40℃~+125℃,覆盖工业级与汽车级温度要求,可在极端环境下稳定运行。

三、封装形式与物理特性

该器件采用TMLF-6封装(尺寸1.6mm×1.6mm),属于超小型无铅封装,具备以下特点:

  • 体积紧凑:1.6×1.6mm的封装尺寸适配高密度PCB布局,可有效节省电路板空间,满足便携设备、小型化模块的设计需求;
  • 引脚功能:包含使能(EN)引脚,支持外部控制输出开启/关闭,便于系统低功耗管理(关断时静态电流进一步降低);
  • 散热设计:TMLF封装的散热结构可满足器件在宽温与满载下的散热需求,避免过热失效。

四、内置保护机制

MIC5353-3.3YMT-TR内置多重保护功能,提升系统可靠性:

  • 过热保护(OTP):当结温超过阈值(典型值150℃左右)时,器件自动关断输出,防止过热损坏;
  • 过流保护(OCP):当负载电流超过限制值(典型值550mA左右)时,器件进入限流模式,避免输出短路或过载导致的器件烧毁;
  • 使能控制:通过EN引脚可手动或系统级控制输出开启/关闭,适配待机场景下的功耗优化。

五、典型应用场景

该LDO因低功耗、小封装、宽温宽等特性,广泛应用于以下领域:

  1. 工业控制:PLC模块、环境传感器节点、电机驱动辅助电路(适应-40℃~+125℃工业环境);
  2. 汽车电子:车载胎压监测传感器、仪表盘辅助电路、摄像头供电(满足汽车级温度与可靠性要求);
  3. 便携设备:智能手环、蓝牙耳机、便携式血糖仪(小封装适配设备小型化,低静态延长电池续航);
  4. 物联网节点:环境监测传感器、智能门锁(低功耗特性适合长期待机的无线节点)。

六、性能优势总结

该器件的核心优势可归纳为:

  • 高效低耗:90μA静态电流+160mV满载压差,兼顾转换效率与待机功耗;
  • 抗扰性强:60dB@1kHz PSRR+30μVrms低噪声,有效抑制电源干扰;
  • 可靠性高:内置OTP、OCP保护,宽温宽设计适应极端环境;
  • 设计灵活:小封装适配高密度布局,使能引脚支持系统级功耗管理;
  • 成本可控:Microchip成熟工艺的量产器件,性价比高,适合批量应用。

综上,MIC5353-3.3YMT-TR是一款平衡性能、尺寸与成本的高性价比LDO,可满足多领域中小功率电源的供电需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.