Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
制造商背景
23LC1024是由Microchip Technology制造的高性能静态随机存取存储器(SRAM),以其优秀的稳定性和可靠性在各种电子应用中脱颖而出。Microchip Technology成立于1989年,是一家全球领先的半导体生产商,专注于提供广泛的微控制器、模拟和混合信号产品。
产品基本参数
功能特性
23LC1024是一款高性能的SRAM器件,拥有易失性存储特性,适合需要高速存储的应用。其宽广的工作电压范围(从2.5V到5.5V)使其能够与多种供电系统兼容,适应不同的电子设备。产品能够在-40°C至85°C的广泛温度范围内稳定工作,符合严苛的工业和汽车环境标准。
通过使用SPI接口,23LC1024提供了灵活的连接方式,支持四个I/O通道,这意味着在高频率情况下数据传输能够更为迅速高效,有助于提升整体系统的性能。此设计使得23LC1024成为快速数据采集、临时数据缓存以及大容量数据存储等多种应用场景的理想选择。
应用场景
23LC1024广泛应用于多种电子设备,包括但不限于:
设计优势
总结
23LC1024-I/SN是Microchip Technology设计制造的一款出色的SRAM解决方案,凭借其优越的性能和可靠性,满足了多种电子应用的需求。无论是在工业自动化、消费类电子、汽车电子还是通信行业,23LC1024都能够为设计工程师提供一种高效、可靠的存储解决方案。由于其易于集成和高性价比,23LC1024续写了Microchip在存储器设计领域的辉煌传统,是当今市场上不可或缺的优质电子元器件之一。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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