WMSIC Electronic Components

MCC M7FL-TP M7FL

ModelM7FL-TP
PackageDO-221AC
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC M7FL-TP
Type
MCC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
M7FL-TP
Electronic Component
1
Package
DO-221AC
Electronic Component
General Purpose Diode
Electronic Component
0.33g
Electronic Component
1
Electronic Component
BM0230021952
Current
1A
Diode
1
Current(Ir)
5uA@1kV
(Vf)
1.1V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M7FL-TP 产品概述

一、产品简介

M7FL-TP 为美微科(MCC)推出的一款通用整流二极管,额定整流电流为 1A,最大反向直流耐压可达 1kV。典型正向压降为 1.1V(在 1A 条件下),具备较低的漏电流与良好的浪涌抗扰能力,适用于各类中高压整流与保护场合。器件采用 DO-221AC 塑封封装,利于手工焊接与散热管理。

二、主要特点

  • 额定反向电压(Vr):1000V,满足高压整流需求;
  • 正向压降(Vf):1.1V @ 1A,损耗可控;
  • 直流整流电流:1A(连续);
  • 反向漏电流(Ir):5µA @ 1kV,低泄漏有利于高压应用的稳压性能;
  • 非重复峰值浪涌电流(Ifsm):30A,能承受短时浪涌冲击;
  • 工作结温范围:-55℃ ~ +150℃,适应宽温区工作环境;
  • 封装:DO-221AC,机械强度和散热性能优于常见小功率封装。

三、电气性能要点

在设计时应根据给定工况关注正向电压与功耗:1A 工作点下 Vf ≈ 1.1V,对应瞬时损耗约 1.1W。长期或高环境温度下需按结温-散热条件进行功率限额与降额设计。反向漏流在高压下仍为 µA 级,有利于高阻抗回路和低泄漏整流场合。

四、热与机械特性

DO-221AC 封装提供更大的散热面积与焊盘接触面,便于通过 PCB 或金属散热片布置导热路径。设计时应保证良好的铜箔面积与热通道,避免局部结温超限。焊接与回流参数遵循制造商推荐,以免长时间高温导致封装应力或可靠性下降。

五、典型应用场景

  • 高压直流整流与滤波(高压电源、测量仪器);
  • 开关电源整流或阻断二极管;
  • 工业电源、充电器前端高压整流;
  • 雷击/浪涌保护及短时脉冲整流场合(需注意 Ifsm 限值)。

六、使用与注意事项

  • 避免长期在极限 Vr 或 Ifsm 条件下工作,必要时并联或选型更高规格器件;
  • 布局时增大散热铜箔并尽量缩短走线,减小寄生电感;
  • 高压测试与应用需严格遵守爬电距离与绝缘规范;
  • 储存与搬运时注意防潮、防污染,焊接时遵循封装工艺规程。

七、订购信息

型号:M7FL-TP;品牌:MCC(美微科);封装:DO-221AC。选型时请参考厂方完整数据手册以获取更详尽的电气特性曲线、热阻参数以及推荐焊接工艺。若有更高电流或更低压降需求,可咨询替代产品或并联/并级方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.