WMSIC Electronic Components

MCC MMS8550-H-TP MMS8550

ModelMMS8550-H-TP
PackageSOT-23
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC MMS8550-H-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
MMS8550-H-TP
Electronic Component
1
Package
SOT-23
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0229358173
Type
Surface Mount
Operating Temperature
55°C ~ 150°C(TJ)
Transistor Type
PNP
Frequency
150MHz
Power
300mW
Electronic Component
Electronic Component
Electronic Component
3000
Current - Collector (Ic)
500mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMS8550-H-TP 产品概述

一、产品简介

MMS8550-H-TP 是美微科(MCC)出品的一款表面贴装型 PNP 双极晶体管,封装为 SOT-23。该器件面向低功耗与中等电流应用,具有高增益与较宽的频率响应,适合便携与消费类电子中的小信号放大与开关场景。

二、主要电气参数

  • 晶体管类型:PNP(单只)
  • 集电极最大电流 Ic:500 mA
  • 最大耗散功率 Pd:300 mW
  • 集射击穿电压 BVCEO:25 V
  • 直流电流增益 hFE(最小):120(测试条件:Ic=50 mA,Vce=1 V)
  • VCE(sat)(最大):600 mV(典型测试条件如 Ic=50 mA)
  • 集电极截止电流 ICBO(最大):100 nA
  • 跃迁频率 fT:150 MHz
  • 工作结温范围 TJ:-55°C 至 150°C

三、产品特点

  • 高 hFE,利于在中等电流下实现小型化偏置设计;
  • 频率特性良好,可用于高频小信号放大;
  • SOT-23 封装适合自动贴装与紧凑 PCB 布局;
  • 低漏电流与宽温度范围,适合工业与汽车电子的耐受需求。

四、典型应用场景

  • 小信号放大器与电平转换;
  • 低功耗开关与驱动电路;
  • 移动设备与便携周边的模拟信号路径;
  • 作为 PNP 补偿元件用于差分、偏置与参考电路。

五、布局与使用建议

  • 在高 Ic 工况下注意散热:采用较大铜箔散热区并缩短走线;
  • 推荐遵循器件数据手册的典型测试条件进行偏置设计,并留有安全裕度;
  • SMT 回流焊时遵循标准温度曲线,避免超过最大结温;
  • 做好静电防护与焊接前后清洁,确保可靠性。

如需完整典型电路、封装尺寸或温度特性曲线,请参阅 MCC 官方数据手册或联系供应商获取详细资料。

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