WMSIC Electronic Components

MCC FSM17PL-TP FSM17PL

ModelFSM17PL-TP
PackageSOD-123FL
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC FSM17PL-TP
Type
SOD-123FL
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
FSM17PL-TP
Electronic Component
1
Package
SOD-123FL
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.043g
Electronic Component
1
Electronic Component
BM0227158587
Current
1A
Current(Ir)
1uA@1kV
(Vf)
1.3V@1A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
2500
Voltage Rating(Vr)
1kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FSM17PL-TP 产品概述

1. 产品简介

FSM17PL-TP 是一款由美微科(MCC)生产的高性能标准二极管,采用表面贴装型封装(SOD-123FL)。该二极管设计用于高电压应用,具有优异的电气性能和可靠性,适用于各种电子设备和电路中的整流和保护功能。

2. 关键特性

  • 高反向电压:最大反向电压(Vr)可达1000V,适用于高电压环境。
  • 正向电压低:在1A的正向电流(If)下,正向电压(Vf)仅为1.3V,有效降低功耗。
  • 快速恢复时间:反向恢复时间(trr)为500ns,适用于快速开关应用。
  • 低反向泄漏电流:在1000V的反向电压下,反向泄漏电流仅为5µA,确保高效能。
  • 宽工作温度范围:结温范围为-65°C至150°C,适应各种环境条件。
  • 表面贴装设计:采用SOD-123FL封装,便于自动化生产和高密度PCB布局。

3. 应用领域

FSM17PL-TP 广泛应用于以下领域:

  • 电源管理:用于AC-DC转换器、DC-DC转换器等电源管理电路中的整流和保护。
  • 工业控制:适用于工业自动化设备中的高电压整流和保护电路。
  • 消费电子:用于电视机、音响设备、家用电器等消费电子产品中的电源和信号处理电路。
  • 通信设备:适用于通信基站、网络设备等通信设备中的高电压整流和保护。

4. 电气参数

  • 正向电压(Vf):1.3V @ 1A
  • 反向电压(Vr):1000V(最大值)
  • 反向泄漏电流:5µA @ 1000V
  • 平均整流电流(Io):1A
  • 反向恢复时间(trr):500ns
  • 电容:15pF @ 4V,1MHz

5. 封装与尺寸

FSM17PL-TP 采用SOD-123FL封装,具体尺寸如下:

  • 长度:2.7mm
  • 宽度:1.6mm
  • 高度:1.1mm

6. 可靠性与环境适应性

  • 工作温度范围:-65°C至150°C,确保在极端环境下的稳定性能。
  • 表面贴装设计:符合RoHS标准,适合无铅焊接工艺,提高生产效率和环保性。

7. 品牌与质量保证

FSM17PL-TP 由美微科(MCC)生产,MCC作为全球知名的半导体制造商,以其高质量和可靠性著称。该产品经过严格的质量控制和测试,确保在各种应用中的长期稳定性和可靠性。

8. 总结

FSM17PL-TP 是一款高性能的标准二极管,具有高反向电压、低正向电压、快速恢复时间和低反向泄漏电流等优异特性。其表面贴装设计和宽工作温度范围使其适用于各种高电压应用场景,包括电源管理、工业控制、消费电子和通信设备等领域。美微科的品牌保证和严格的质量控制,使得FSM17PL-TP成为工程师和设计师在高电压整流和保护应用中的理想选择。

通过以上详细的概述,FSM17PL-TP 展现了其在电子元器件领域中的重要地位和广泛应用前景。无论是在性能、可靠性还是环境适应性方面,FSM17PL-TP 都表现出色,能够满足现代电子设备对高效能和高可靠性的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.