Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCC SI2301A-TP SI2301A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC SI2301A-TP
- Type
- MCC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- SI2301A-TP
- Electronic Component
- 1
- Package
- SOT-23-3
- Electronic Component
- 1 P
- Type
- P
- Electronic Component
- MOSFET
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0040836766
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 20V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SI2301A-TP 产品概述
产品简介
SI2301A-TP是一款高效能的P沟道金属氧化物半导体场效应晶体管（MOSFET），具有卓越的电气特性和工作稳定性，尤其适合于低电压应用及高频开关电路。该产品采用SOT-23-3封装，适用于表面贴装技术（SMT），便于在空间受限的设计中实现高性能。
基本参数
漏源电压（Vdss）：SI2301A-TP的最大漏源电压为20V，适合用于低压供电的电子设备。
连续漏极电流（Id）：该器件在25°C时能够承受最大连续漏极电流为2.8A，确保在日常工作环境下能够稳定地传递电流。
导通电阻（Rds(on)）：在不同的漏极电流（Id）和栅源电压（Vgs）条件下，该产品的最大导通电阻为120毫欧（在4.5V及2.8A时），此较低的导通电阻保证了设备在导通状态下的高效能及低功耗。
功率耗散：该MOSFET的最大功率耗散为1.25W，这一参数是其在设计系统冷却和热管理方面的重要考虑。
输入电容（Ciss）：在6V时，SI2301A-TP的最大输入电容为880pF，使其在高频应用中表现出更短的开关时间和更快的响应速度。
栅极电荷（Qg）：在4.5V条件下，该产品的最大栅极电荷为14.5nC，显示其在开关过程中的高效率，适合搭配低功耗驱动器。
工作温度范围：SI2301A-TP的工作温度范围极为广泛，能够在-55°C至150°C的环境条件下运行，因而适合用于严苛的工业和汽车应用场合。
Vgs（最大值）：本器件的栅源电压最大值为±8V，使其在各种负载条件下均能保持稳定的开关性能。
阈值电压（Vgs(th)）：不同Id下的Vgs(th)最大值为900mV（在250µA时），意味着该MOSFET能够在较低的驱动电压下导通，进一步增强设计灵活性。
应用领域
SI2301A-TP的出色性能使其在以下领域得到广泛应用：
电源管理：适用于开关电源、DC-DC转换器和功率管理电路。
低电压电路：适合LED驱动器、马达驱动电路等低电压应用。
嵌入式系统：由于其低功耗特性，该器件可广泛用于各类消费电子产品及智能设备，如智能家居产品、便携式设备等。
工业控制：在工业自动化及控制系统中，SI2301A-TP可用作驱动和开关器件，提升系统的响应速度与可靠性。
总结
SI2301A-TP是一款高效稳定的P沟道MOSFET，具备多种优异特性，能够在多种复杂应用环境中发挥作用。无论是电源管理、低电压电路，还是嵌入式系统，该器件都能够提供可靠的性能和优异的热管理，帮助工程师实现高效的电路设计，为电子产品的性能提升打下坚实的基础。选择SI2301A-TP，将为您的电子设计提供更大的灵活性和可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
