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MCC BAS70-05-TP BAS70
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC BAS70-05-TP
- Type
- MCC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- BAS70-05-TP
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0227151423
- Current
- 70mA
- Diode
- 1
- Current(Ir)
- 200nA@50V
- (Vf)
- 1V@15mA
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 70V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAS70-05-TP 产品概述
一、产品简介
BAS70-05-TP 为美微科（MCC）生产的一款双二极管阵列，采用1对共阴极（共阴）配置，基于肖特基势垒结构，适用于高速开关、整流与钳位应用。器件为表面贴装型，封装为SOT-23（TO-236-3 / SC-59），体积小、响应快、易于自动贴装与回流焊接。
二、主要参数
- 配置：1对共阴极（双二极管，共阴）
- 正向压降：Vf = 1.0 V @ If = 15 mA
- 直流反向耐压：Vr = 70 V
- 反向电流：Ir = 200 nA @ Vr = 50 V
- 整流电流（直流）：IF(DC) = 70 mA
- 封装：SOT-23（TO-236-3 / SC-59）
- 品牌：MCC（美微科）
三、产品特性
- 低正向压降：在中等电流（15 mA）下Vf约1 V，有助于降低功耗和发热。
- 低反向漏电：50 V 条件下反向电流仅约200 nA，适合需要低泄漏的整流与检测电路。
- 中高反向耐压：70 V 的耐压等级适用于多数低压电源与信号保护场景。
- 小型SMD封装：SOT-23体积小，便于高密度线路板设计与自动化生产。
四、典型应用
- 高速数字信号钳位与保护
- 低压差整流与检测电路
- 电平移位与混频器中的肖特基整流元件
- 便携式电源、通信设备与消费电子中需要低耗和快速恢复的场合
五、封装与PCB注意事项
- SOT-23 封装适合回流焊工艺，建议按常规SMT回流曲线进行焊接；对湿敏等级与储存按供应商资料处理。
- 布线建议：输入/输出走短而粗的走线以减小寄生电感与压降；靠近热源元件留出散热路径，尽量避开高温器件。
- 为保证可靠性，布局时考虑到双二极管的共阴连接，明确阳极引脚走向以便对称布局。
六、采购与替代信息
- 正式型号：BAS70-05-TP，品牌：MCC（美微科），封装：SOT-23。
- 选型时如需替代，可寻找规格相近的双肖特基共阴二极管，重点匹配关键参数：Vr ≥ 70 V、IF(DC) ≥ 70 mA、Vf 在工作电流下接近 1 V 以及低反向漏电特性。采购与实际使用前建议参照供应商数据手册获取完整电气特性、封装尺寸及回流焊工艺规范。
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