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MCC SL210PL-TP SL210PL
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MCC SL210PL-TP
- Type
- MCC
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MCC
- Electronic Component
- SL210PL-TP
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.044g
- Electronic Component
- 1
- Electronic Component
- BM0264209774
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 100uA@100V
- (Vf)
- 720mV@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SL210PL-TP 产品概述
一、产品简介
SL210PL-TP 是美微科（MCC）推出的一款肖特基整流二极管，采用 SOD-123FL 表面贴装封装，单只独立式器件。器件设计用于中等功率整流与快速恢复场合，具有较低正向压降和良好的高压阻断能力，适合开关电源、功率管理以及各类保护电路应用。
二、主要特性
- 类型：肖特基整流二极管（单只，独立式）
- 反向耐压：100 V（Vr）
- 整流电流：2 A（DC）
- 正向压降：典型 720 mV @ 2 A（Vf）
- 反向漏电流：100 µA @ 100 V（Ir）
- 非重复峰值浪涌电流：50 A（Ifsm）
- 工作结温范围：-55 ℃ 至 +150 ℃
- 封装：SOD-123FL，适合表面贴装自动化生产
三、电气参数与工作条件
SL210PL-TP 在 2 A 直流工况下保持较低的正向压降（约 0.72 V），能有效降低整流损耗与系统发热。器件在最大直流反向电压 100 V 下的反向漏电流为 100 µA，适用于需要高阻断电压但允许小量泄漏电流的场合。非重复性浪涌能力 50 A，可承受瞬态冲击，但连续或频繁浪涌应通过合适的热设计与限流电路来保护器件。
四、封装与热性能
SOD-123FL 封装兼顾尺寸与散热，便于高速贴片与自动化生产。实际可允许的持续电流取决于 PCB 的铜箔面积与散热设计，建议在电流接近额定值时采用加大铜箔、敷设过孔或热铜面来改善散热，从而降低结温并延长寿命。封装适配常见 SMT 贴装与回流焊工艺，请参照制造商推荐的焊接工艺规范进行组装。
五、典型应用
- 开关电源（整流、续流）
- 电源管理模块与降压/升压转换器
- 反向保护与极性保护电路
- 车载电子（需注意温度及振动条件下的可靠性设计）
- 管脚或模块级瞬态浪涌保护
六、可靠性与使用建议
为保证长期可靠性，建议注意以下要点：
- 在高电流工作时做好 PCB 的热设计，必要时采用铜箔散热或散热片。
- 避免频繁超过 Ifsm 的浪涌事件，必要时外接浪涌抑制元件。
- 回流焊请参考厂商数据表的温度曲线与时间限制进行，不建议超过封装材料的热极限。
- 在高压环境下，应考虑器件周围绝缘与爬电距离，避免表面泄漏或击穿。
七、封装与采购信息
SL210PL-TP 提供 SOD-123FL 表面贴装封装，适合卷带（Tape & Reel）供料方式以满足自动贴片生产需求。具体包装、最小起订量及可得性请联系美微科（MCC）或授权分销商，并以最新数据手册为准。
如需更详尽的电气特性曲线、热阻值或回流焊参数，请向供应商索取完整数据手册，以便在设计中进行准确的热与电性能评估。
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