WMSIC Electronic Components

MCC SI2310AHE3-TP SI2310AHE3

ModelSI2310AHE3-TP
PackageSOT-23
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC SI2310AHE3-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
SI2310AHE3-TP
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.044g
Electronic Component
1
Electronic Component
BM0230021955
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.2W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
409pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI2310AHE3-TP 产品概述

一、产品简介

SI2310AHE3-TP 是美微科(MCC)面向汽车与工业领域的 N 型增强型场效应管(N‑Channel Enhancement Mode FET),采用 SOT‑23 小封装设计。器件耐压 60V、连续漏极电流 3A,适用于 12V 车载系统及中等电流开关场合。该器件为单颗 N 沟道 MOSFET,兼顾低导通损耗与紧凑封装,适合做开关电源低压侧、负载开关与继电器/电磁阀驱动等应用。

二、主要电气参数

  • 漏‑源耐压 (Vdss):60V
  • 连续漏极电流 (Id):3A
  • 导通电阻 (RDS(on)):120 mΩ @ Vgs = 4.5V,Id = 2A
  • 耗散功率 (Pd):1.2W(SOT‑23 封装)
  • 栅阈电压 (Vgs(th)):900 mV(典型)
  • 总栅极电荷 (Qg):10.27 nC @ Vgs = 10V
  • 输入电容 (Ciss):409 pF @ Vds = 10V
  • 反向传输电容 (Crss,Miller):41 pF @ Vds = 10V
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT‑23(小型表面贴装)

三、性能特点与优势

  • 60V 耐压确保在常见汽车电气环境(含负载转瞬高压)下具有良好裕度,适合电机驱动、车灯、继电器控制等。
  • 在逻辑电平驱动(4.5V)下即可达到 120 mΩ 的导通电阻,适合与微控制器或车规驱动芯片配合使用。
  • 较低的栅极总电荷(~10.3 nC@10V)与中等输入电容(409 pF)使器件在中低频开关应用中开关损耗可控,适合开关频率不很高的 DC‑DC 或负载切换场景。
  • SOT‑23 封装占板面积小,利于空间受限的电控单元(ECU)和模块化设计。

四、应用场景

  • 车载低压开关与负载断开(车门、舒适系统、灯光等)
  • 继电器替代器 / 线圈驱动低侧开关
  • 中小功率 DC‑DC 降压电源(低侧元件)
  • 电池管理与保护电路(配合热/电流监控)
  • 工业控制中的通用开关与保护电路

五、设计建议与注意事项

  • 栅极驱动:尽管 Vgs(th) 约 0.9V,但该值仅为导通门槛。实际要达到低 RDS(on) 应使用 4.5V 或更高的门极驱动电压;若系统仅有 3.3V 驱动,请在电路上验证实际导通电阻与功耗是否符合需求。
  • 开关损耗与驱动器选型:Qg ≈ 10.27 nC 在 10V 时属于中等值,若进行快速切换(高频),需要确保驱动器能够提供足够电流以缩短上升/下降时间,否则会增加开关损耗与发热。
  • Miller 效应:Crss = 41 pF 会在快速变化的 Vds 下产生显著的米勒电容影响,可能导致开关过渡时间延长或产生振荡。推荐对栅极引线做阻尼(串联栅阻)与合理 PCB 走线布局。
  • 热管理:SOT‑23 的额定耗散功率为 1.2W,在高环境温度或连续大电流条件下需考虑封装热阻与 PCB 散热(增加铜面积、使用散热过孔或热铜带)。在高温下需对额定电流进行充分降额(derating)。
  • 可靠性与汽车级要求:器件描述为 Automotive 定位,具体是否满足 AEC‑Q100/其它车规认证请查阅完整数据手册与厂方认证声明;车载应用建议采用经过认证的元件并进行系统级验证。

六、封装与采购提示

  • 封装类型为 SOT‑23,尺寸小、适用于自动贴装。请在 PCB 布局时预留足够过孔或铜面以优化散热。
  • 在采购与替换元件时,注意查看完整数据手册以确认引脚排列、绝对最大额定值、典型特性曲线和温度依赖性参数(例如 RDS(on) 随温度升高的增长)。

结论:SI2310AHE3‑TP 在 60V 耐压与 3A 等级下,兼具逻辑级驱动能力和紧凑 SOT‑23 封装,是适用于车载与工业中低功率开关场合的实用 MOSFET。设计时重点关注栅极驱动、电路开关损耗与封装热管理,能在小尺寸方案中实现良好的开关与导通性能。若需详细引脚定义与典型波形,请参阅厂方完整数据手册。

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