WMSIC Electronic Components

MCC ESD15VT2HE3-TP ESD15VT2HE3

ModelESD15VT2HE3-TP
PackageSOT-23
BrandMCC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MCC ESD15VT2HE3-TP
Type
MCC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MCC
Electronic Component
ESD15VT2HE3-TP
Electronic Component
1
Package
SOT-23
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.033g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0265158992
Operating Temperature
55℃~+150℃
Voltage
35V
Voltage(VBR)
19V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD15VT2HE3-TP 产品概述

一、产品简介

ESD15VT2HE3-TP 是美微科(MCC)推出的一款高性能双通道单向瞬态电压抑制(TVS)二极管,专为保护敏感电子信号免受静电放电(ESD)、浪涌和电快速瞬变(EFT)等瞬态过电压冲击而设计。器件采用 SOT-23 小型封装,可在空间受限的产品中实现可靠的两路信号防护。

二、主要性能参数

  • 极性:单向(正向导通特性,便于接地作为参考侧)
  • 反向截止电压 Vrwm:15 V(工作电压上限,在此电压下器件呈高阻态)
  • 击穿电压 VBR:19 V(在指定电流下的击穿起始电压)
  • 钳位电压 Vc:35 V(峰值脉冲时对电压的限制能力)
  • 峰值脉冲电流 Ipp:8 A,波形 8/20 μs(单次浪涌承受能力)
  • 峰值脉冲功率 Ppp:280 W(单次脉冲能量处理能力)
  • 通道数:双路(两路独立保护,节省 PCB 空间)
  • 工作温度范围:-55 ℃ ~ +150 ℃(适应极端环境)
  • 类型:ESD(专用于瞬态抑制)
  • 封装:SOT-23(小型化、适合表面贴装)

三、封装与引脚(SOT-23)

器件采用常见的 SOT-23 3 引脚封装,内部包含两路 TVS 单元。典型应用为两路信号分别连接至器件的两输入引脚,另一端接地或共用参考节点。具体引脚排列与内部连线方式请参照厂方数据手册以确保正确接线与安装。

四、应用场景

ESD15VT2HE3-TP 适合用于各种对静电和瞬态干扰敏感的消费电子和工业设备,包括但不限于:

  • USB、HDMI、Ethernet 等高速接口保护
  • 无线模块与射频前端保护(信号链路)
  • 汽车电子低压信号保护(需配合系统级设计)
  • 工业控制器、人机界面(HMI)和传感器线路保护

五、典型电路与设计要点

  • 建议将器件尽量靠近受保护的接口或连接器布局,缩短 PCB 走线长度以降低感性和电阻引起的电压上升。
  • 对于单向 TVS,注意器件方向:在正常工作时为高阻态,发生反向瞬态时导通至地。安装时保证参考地可靠且低阻。
  • 若系统有多次脉冲或更高能量要求,可在前级增加串联阻抗(如小电阻或铁氧体)以分担能量;注意不要在 TVS 与保护节点之间放置大电容以免影响响应速度。
  • 重流与热耗散设计:SOT-23 封装的瞬态能量吸收受 PCB 走线和铜箔散热能力影响,需在 PCB 设计中考虑散热铜面积和过孔布局。

六、可靠性与工作环境

  • 工作温度覆盖 -55 ℃ 至 +150 ℃,适应严苛环境与温度循环。
  • 设计用于反复短时高能量冲击,但对于频繁或长期高能量浪涌,建议进行系统级保护设计以延长器件寿命。
  • 在高湿或腐蚀性环境下应配合适当的封装保护与涂覆工艺,保证长期可靠性。

七、订购信息与注意事项

  • 型号:ESD15VT2HE3-TP,品牌:MCC(美微科),封装:SOT-23。
  • 在选型与最终设计前,请务必参考 MCC 官方数据手册获取完整的电气特性曲线、引脚定义、推荐焊盘及回流焊工艺参数。
  • 关注系统的极限工作电压(Vrwm)与钳位电压,保证在正常工作条件下器件不进入导通状态,同时在 ESD 或浪涌发生时能有效钳位,保护下游电路。

如需提供原理图连接示例、PCB 封装建议或与特定接口的兼容性评估,可根据您的具体应用场景进一步给出定制化建议。

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