WMSIC Electronic Components

MDD SMAJ6.5A

ModelSMAJ6.5A
PackageSMA(DO-214AC)
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD SMAJ6.5A
Type
MDD
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
SMAJ6.5A
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.094g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0229465215
Operating Temperature
65℃~+150℃
Voltage
11.2V
Current(Ir)
500uA
Voltage(VBR)
7.98V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMAJ6.5A — MDD 单向 TVS 瞬态抑制二极管产品概述

一、产品概述

SMAJ6.5A 是 MDD 提供的一款单路单向瞬态抑制二极管(TVS),采用 SMA(DO‑214AC)封装,专为保护电源线与信号线免受雷击、开关瞬变、ESD 等脉冲过电压而设计。该器件在 10/1000 μs 浪涌波形下具有 400 W 峰值脉冲功率吸收能力,能在严苛的工业及汽车电子工作环境中提供可靠的过压钳位保护。

二、主要参数摘要

  • 基本类型:TVS 二极管(单向)
  • 封装:SMA (DO‑214AC)
  • 品牌:MDD
  • 额定反向工作电压 (Vrwm):6.5 V
  • 击穿电压范围 (VBR):7.22 – 7.98 V
  • 钳位电压 (VC):11.2 V(对应脉冲条件下测得)
  • 峰值脉冲功率 (Ppp):400 W(采用 10/1000 μs 波形)
  • 峰值脉冲电流 (Ipp):35.7 A(10/1000 μs)
  • 反向漏电流 (Ir):500 μA(在 Vrwm 条件下)
  • 工作温度范围:-65 ℃ ~ +150 ℃
  • 通道数 / 极性:单路 / 单向

三、器件特性与优势

  • 高脉冲吸收能力:在 10/1000 μs 波形下可吸收 400 W 峰值功率,应对雷击与大能量浪涌能力强。
  • 低钳位电压:在峰值脉冲电流条件下钳位电压为 11.2 V,能够有效限制被保护电路的过压幅度,减小后级器件应力。
  • 宽温度适应:工作温度范围达 -65 ℃ 至 +150 ℃,适合多种工业及高温环境应用。
  • 小型标准封装:SMA 封装便于自动化贴装与批量生产,同时兼顾散热与占板面积。

四、典型应用场景

  • 工业控制及自动化设备:用于电源总线、模块间接口的过压保护。
  • 汽车电子外围保护:适用于车载传感器、控制模块的浪涌防护(需满足汽车等级验证时参照车规要求)。
  • 通信与基站设备:保护信号线与供电线免受雷击或大能量浪涌影响。
  • 电源适配器与逆变器前端防护:抑制来自外部电源或接线引入的瞬态过压。
  • 其他需要稳健瞬态抑制的场合:安防、医疗仪器、测量仪表等。

五、封装与机械说明

SMA(DO‑214AC)为常见的表面贴装封装形式,利于波峰/回流焊工艺与自动贴装。详细尺寸与焊盘建议请参考 MDD 官方数据表,以保证良好的焊接可靠性与热耗散性能。

六、使用与布局建议

  • 靠近受保护节点放置:将 TVS 元件尽可能靠近被保护的端口或器件(如连接器、电源入口),以最小化线路感抗导致的残压升高。
  • 合理走线和焊盘:使用短、宽的接地电流回路,确保回流路径低阻抗,减小钳位效果退化。
  • 与输入滤波器配合:若系统存在 LC/RC 滤波组件,注意滤波器与 TVS 的相互作用,必要时在 TVS 前设置合适的防止振荡的阻尼元件。
  • 参考温升与功耗:长时间高频率浪涌或多次大能量冲击会累积能量,设计时考虑到器件热耗散与附近器件的热影响。

七、可靠性与注意事项

  • 测试条件依赖:上述钳位电压、Ipp 与 Ppp 等参数均基于 10/1000 μs 脉冲波形测试,实际应用中的波形与能量不同会影响参数表现。
  • 漏电流与温度:反向漏电流会随温度上升而增大,在高温环境下需评估系统容忍度。
  • 焊接工艺:推荐遵循 MDD 官方推荐的焊接工艺与回流温度曲线,避免超出封装及内部材料承受范围。
  • 选型确认:在关键或车规级应用中,建议在最终系统条件下进行完整的浪涌试验与长期可靠性验证。

如需完整电气特性曲线、封装尺寸图或针对特定应用的布局范例,可提供详细需求,以便进一步给出针对性的工程建议与参考资料。

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