WMSIC Electronic Components

MDD BZT52C8V2S

ModelBZT52C8V2S
PackageSOD-323
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD BZT52C8V2S
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
BZT52C8V2S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
±5%
Electronic Component
0.026g
Electronic Component
1
(Zzt)
30Ω
Electronic Component
BM0264866561
Diode
1
Current(Ir)
500nA@5V
Power Dissipation(Pd)
200mW
Electronic Component
7.7V~8.7V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C8V2S稳压二极管产品概述

一、产品基本信息

BZT52C8V2S是MDD品牌推出的一款表面贴装型稳压二极管,型号中“BZT52”为系列标识,“C8V2”代表标称稳压值8.2V,“S”对应SOD-323封装(超小型表面贴装封装)。该器件专为小型化、低功耗电路设计,是消费电子、便携式设备等领域的通用稳压元件。

二、核心电性能参数详解

BZT52C8V2S的电性能参数经过优化,兼顾精度与实用性:

  • 稳压特性:标称稳压值8.2V,精度等级±5%,对应稳压范围7.7V~8.7V,可满足多数普通电路对参考电压的精度要求,无需额外校准即可实现稳定输出;
  • 低反向漏电流:在5V反向偏置条件下,漏电流仅500nA,显著降低待机功耗,尤其适合电池供电的便携式设备;
  • 额定耗散功率:最大耗散功率200mW,结合标称稳压值计算,最大允许稳压电流约24.4mA(公式:(I_{zm} = P_d / V_z)),可支撑小型负载的稳压需求;
  • 动态阻抗:稳压状态下动态阻抗(Z_{zt})为30Ω,阻抗值较低,意味着当负载电流或输入电压小幅波动时,稳压值变化较小,稳压特性稳定。

三、封装特性与适用场景

1. SOD-323封装优势

SOD-323为超小型表面贴装封装,尺寸约1.6mm×0.8mm,占板面积仅为传统插件封装的1/5左右,适配高密度PCB布局,可有效缩小电路体积。

2. 典型应用场景

  • 便携式电子设备:手机、智能手环、蓝牙耳机等电池供电产品的电源稳压辅助(如为传感器、蓝牙模块提供基准电压);
  • 小型电子模块:温湿度传感器、光传感器模块的参考电压源,确保模块输出稳定;
  • 消费类电子:遥控器、小型家电(如智能插座)的低压稳压电路,保护敏感控制电路;
  • 工业控制:小型PLC、数据采集器的辅助稳压,过滤输入电压波动。

四、产品核心优势

  1. 低功耗设计:500nA的反向漏电流,待机状态下几乎不消耗额外功率,延长电池续航;
  2. 高精度稳压:±5%的精度覆盖日常稳压需求,避免因稳压值偏差导致的电路性能波动;
  3. 小型化适配:SOD-323封装适配紧凑电路布局,满足便携式设备的“轻薄化”设计要求;
  4. 稳定可靠性:30Ω低动态阻抗,负载波动下稳压值变化小,可长期稳定工作于常规环境温度(-55℃~150℃)。

五、使用注意事项

  1. 功率限制:实际工作中,器件耗散功率不得超过200mW,避免过流导致热损坏(可通过串联限流电阻控制电流);
  2. 焊接规范:SOD-323封装焊接需控制温度(回流焊峰值温度≤260℃,时间≤10秒),避免封装变形或性能下降;
  3. 极性确认:稳压管需反向接入电路(阴极接正、阳极接负),正向接入无稳压作用,且可能因过流损坏;
  4. 静电防护:存储与焊接过程中需采取静电防护措施(如使用防静电工作台、离子风机),避免静电击穿器件。

BZT52C8V2S凭借其小型化、低功耗、高精度的特点,成为消费电子、便携式设备等领域的高性价比稳压解决方案,可满足多数常规电路的稳压需求。

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