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MDD BZT52C3V6S
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD BZT52C3V6S
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- BZT52C3V6S
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.028g
- Electronic Component
- 1
- (Zzt)
- 130Ω
- Electronic Component
- BM0264048254
- Diode
- 1
- Current(Ir)
- 10uA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 3.4V~3.8V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C3V6S稳压二极管产品概述
一、产品基本信息
BZT52C3V6S是MDD品牌推出的一款独立式稳压二极管，采用SOD-323超小型表面贴装封装，为2引脚设计（阴极带色环标识，便于极性识别）。该器件无内部并联/串联元件，属于单一稳压管结构，可独立完成电压稳定功能，适配高密度PCB布局需求。
二、核心电性能参数
1. 稳压特性
标称稳压值为3.6V，稳压范围覆盖3.4V~3.8V，兼顾生产公差与温度变化的影响，可在常规环境温度下保持输出电压的稳定性，满足多数低精度电路的电压需求。
2. 反向漏电流
在反向电压1V的测试条件下，反向电流（Ir）典型值为10uA，属于低漏电流水平，适合电池供电的低功耗设备（如便携式电子），可减少待机状态下的能量损耗。
3. 功率与阻抗
- 最大耗散功率（Pd）：200mW，推导最大稳压电流（Iz）约为55mA（公式：Iz ≤ Pd/Vzt = 200mW/3.6V），满足小型电路的功率承载需求；
- 动态阻抗（Zzt）：典型值130Ω，反映工作电流变化时的电压波动特性，适用于对电压波动要求不苛刻的常规场景。
三、封装与机械特性
SOD-323封装具有以下优势：
- 尺寸紧凑：常规尺寸为1.6mm（长）×0.8mm（宽）×0.6mm（高），可大幅节省PCB空间，适配小型化设备；
- 焊接兼容：支持回流焊、波峰焊等常规表面贴装工艺，符合电子制造行业标准流程；
- 可靠性：采用耐高温塑料封装，可承受焊接高温冲击（峰值温度260℃±5℃，时间≤10秒），长期使用稳定性良好。
四、典型应用场景
- 便携式电子电源稳压：如智能手机、蓝牙耳机、智能手环等电池供电设备，为MCU、传感器等模块提供稳定3.6V工作电压；
- MCU参考电压源：适配低功耗MCU的3.3V~3.6V参考电压需求，确保AD转换、时钟功能的准确性；
- 传感器电路电压钳位：防止温度/压力传感器等敏感元件因静电放电、电源尖峰损坏；
- 小型消费类电子辅助稳压：如智能手表、无线耳机的充电电路，配合电容/电阻组成简单稳压回路，提升电源稳定性。
五、选型与使用注意事项
- 稳压值匹配：若应用场景对电压精度要求较高（如精密AD转换），需结合3.4V~3.8V的稳压范围进行误差分析；
- 功率限制：电路中需控制稳压管工作电流≤55mA，避免过功率导致器件失效；
- 漏电流评估：实际工作中反向电压升高会增大漏电流，需根据电路电压评估对功耗的影响；
- 焊接规范：注意阴极色环极性，避免反接；回流焊温度需符合IPC标准，防止封装损坏。
BZT52C3V6S凭借小型化、低功耗、稳定稳压的特性，成为低功耗、高密度电路设计中稳压方案的优选器件，广泛适用于消费类电子与小型电子设备的电源管理场景。
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