WMSIC Electronic Components

MDD 1SMA4746A

Model1SMA4746A
PackageSMA(DO-214AC)
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD 1SMA4746A
Type
MDD
Minimum package
5000

Technical parameters

Electronic Component
MDD
Electronic Component
1SMA4746A
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Zener Diode
Electronic Component
0.094g
Electronic Component
1
(Zzt)
20Ω
Electronic Component
BM0228088999
Diode
1
Current(Ir)
5uA@13V
Power Dissipation(Pd)
1W
Electronic Component
16.8V~19.2V
Electronic Component
55℃~+150℃
Electronic Component
5000
Electronic Component
18V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SMA4746A 产品概述

一、产品简介

1SMA4746A 是 MDD 品牌推出的一款独立式稳压二极管(Zener diode),标称稳压值为 18V,稳压范围为 16.8V ~ 19.2V。器件采用 SMA (DO-214AC) 封装,适合表面贴装应用。其小巧的封装和稳定的电气特性,使其成为电源保护、基准稳压与浪涌抑制等场景中常用的元件。

二、主要电气参数

  • 稳压值(标称):18V
  • 稳压值范围:16.8V ~ 19.2V
  • 反向电流 Ir:5 µA @ 13V(典型规格条件)
  • 阻抗 Zzt:20 Ω(动态阻抗,反映稳压特性下的小信号阻抗)
  • 最大耗散功率 Pd:1W(在规定散热条件下的功耗极限)
  • 工作结温范围:-55℃ ~ +150℃

以上参数可用于快速评估器件在不同工作点下的行为,特别是在低漏电与中等功率稳压需求时具有优势。

三、封装与热特性

SMA(DO-214AC)封装提供了良好的机械强度和热散能力,便于自动贴装与回流焊工艺。在 PCB 上实际可承受的耗散功率与布局、铜箔面积和散热环境密切相关:标称 Pd=1W 是在推荐的散热条件下测得,若 PCB 铜皮面积有限或环境温度较高,器件结温可能升高,应通过增大散热铜箔或降低工作电流来保证可靠性。器件可在 -55℃ 至 +150℃ 的结温范围内长期工作,适应宽温度应用。

四、典型应用场景

  • 基础稳压/参考源:为局部电路提供 18V 左右的稳压参考,适用于低功耗稳压需求场合。
  • 电源过压保护:在电源线上作为限压元件,吸收小幅度过压瞬变,保护后级电路。
  • 信号线路保护:用于保护对电压敏感的模拟或数字接口,限制反向或过高电压。
  • 测试与校准电路:作为电压基准或校准点,结合外部电阻形成简单的分压/稳压单元。

五、选型与使用注意事项

  1. 功耗与结温控制:稳压二极管的功耗 Pd = (Vr - Vload) × Iz,使用时需计算实际通过的稳流电流,确保不超过 1W 并留有安全裕度。
  2. 动态阻抗影响稳压精度:Zzt=20Ω 表明在较大电流变化时输出电压会有一定波动,需结合电路中允许的电压容差选择合适型号或并联/串联其它元件优化。
  3. 反向漏电:Ir 在 13V 时为 5 µA,适合要求较低漏电的应用;但在更高温或更高反向电压条件下漏电会增加,应注意热耗与偏置条件。
  4. 焊接与 PCB 设计:建议在焊盘处保留适当的铜皮面积以增强散热,遵循回流焊温度曲线并避免在极端焊接条件下直接过热器件。

六、封装焊接与储存建议

  • 回流焊工艺:遵循 SMT 回流规范,避免超出器件最大结温与允许的焊接峰值温度。
  • PCB 布局:尽量在器件底部和相邻区域增加散热铜箔,或通过过孔与内层铜箔分散热量。
  • 储存与防潮:按常规电子元器件防潮要求存放,长时间暴露在潮湿环境可能影响焊接质量。

总结:1SMA4746A 以其 18V 标称稳压、低漏电特性和 SMA 封装的可靠性,适合中低功耗稳压与过压保护场景。在选型与设计中需关注实际工作电流、散热条件和动态阻抗对稳压精度的影响,以确保长期稳定可靠运行。

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