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MDD BZT52C7V5
Configuration
1 options
Configuration
Option 138075
Availability on request
Technical data
Product details
19
specifications
Core information
- Product name
- MDD BZT52C7V5
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- BZT52C7V5
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- (Zzt)
- 30Ω
- Electronic Component
- BM0258755400
- Diode
- 1
- Current(Ir)
- 500nA@4V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 7.13V~7.88V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C7V5 产品概述
一、主要参数
BZT52C7V5 是一款独立式小功率稳压二极管，标称稳压值为 7.5V，稳压值典型范围为 7.13V ~ 7.88V。关键电气参数包括反向电流 Ir = 500nA @ 4V、稳压阻抗 Zzt = 30Ω，以及最大耗散功率 Pd = 500mW（SOD-123 封装）。制造品牌：MDD；封装形式：SOD-123，适合表面贴装应用。
二、产品特点
- 标准化稳压电压 7.5V，适用于需要中低电压参考/稳压的应用。
- 低漏电流（在低电压下 Ir = 500nA），有利于低功耗电路中的偏置稳定。
- 相对较小的稳压阻抗（Zzt = 30Ω），在中等工作电流下可提供较好的纹波抑制。
- SOD-123 小体积封装，便于密集 PCB 布局，适合自动贴装。
三、封装与热管理
SOD-123 小体积封装使器件适合表面贴装，但同时限制了散热能力。标称 Pd = 500mW 通常是在 25°C 环境下测得的最大耗散值，实际使用时应考虑环境温度与 PCB 散热条件进行降额处理。在高温或散热受限的场合，需减小稳压二极管上的功率耗散或采用更大功率的替代器件。
四、典型应用场景
- 作为稳压参考源，用于小电流偏置或模拟前端参考。
- 过压/浪涌保护电路的电平钳位。
- 消除电源纹波、提供简单的基准电压（配合串联限流电阻）。
- 通讯设备、传感器接口与便携式电子产品中的低功耗偏置电路。
五、设计与使用注意事项
- 常见的稳定连接方式为并联（分流）稳压：在电源与负载间串联限流电阻 R，R 的选取依据为 R = (Vin_min - Vz) / Iz，其中 Iz 为稳压二极管工作电流，应同时满足负载电流需求与稳压性能。
- 由于 Zzt 有限，稳压精度和纹波抑制随电流变化而变化，设计时应参考完整数据手册中关于测试电流与阻抗的曲线。
- 注意反向漏电在高阻抗测量回路中的影响，Ir = 500nA 在某些精密低电流场合可能不可忽略。
- 在高温条件下须进行功率降额，避免长期超过封装允许的结温。
六、可靠性与焊接
采用标准回流焊工艺时，应遵循 SOD-123 封装的温度曲线规范，避免过冲和长时间高温。装配后建议进行焊点检查与必要的老化/电气测试，以确认稳压特性和漏电行为稳定。
七、选型建议与替代
选择时除关注标称 7.5V 外，应核对完整数据表中稳压电流 Iz、温度系数、击穿前后特性及最大结温。若需要更高功率或更低阻抗，可选更大封装或功率等级的稳压二极管；若要求更精准的参考电压，建议使用带封装参考源或低温漂基准芯片。
如需样片或批量采购，请参考 MDD 的产品料号并与供应商确认数据手册，以获得完整的电气特性曲线与封装尺寸资料。
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