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MPS MP86945-AGVT-Z
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- MPS MP86945-AGVT-Z
- Type
- MPS
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MPS
- Electronic Component
- MP86945-AGVT-Z
- Electronic Component
- 1
- Package
- TQFN-25(4x5)
- Electronic Component
- (OCP); (OTP)
- Electronic Component
- Intelligent Power Module (IPM)
- Electronic Component
- 1g
- Electronic Component
- 1
- Electronic Component
- BM0258859744
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 4.5V~16V
- Load Type
- MOSFET
- Driver
- Electronic Component
- (tr)
- 15ns
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MP86945-AGVT-Z 产品概述
一、产品简介
MP86945-AGVT-Z 是由 Monolithic Power Systems (MPS) 推出的高性能半桥驱动器，品牌 MPS。该器件以 TQFN-25（4×5 mm）封装提供，包装方式为卷带（TR），器件状态为有源。器件描述为 “IC HALF-BRIDGE 60A 25TQFN”，表明其针对功率 MOSFET/IGBT 的高驱动能力与紧凑封装进行了优化，适合高开关速度与高效率电源和电机驱动场景。
二、主要特点
- 高峰值驱动能力：器件具备高达 60A 峰值的驱动能力，能够快速改变栅极电荷，缩短开关时间，降低开关损耗。
- 半桥拓扑：集成高侧与低侧栅极驱动通道，便于实现半桥（high-side / low-side）驱动结构，适配同步整流或逆变器应用。
- 紧凑封装：TQFN-25 (4×5 mm) 低电感封装，利于高速开关下的寄生抑制与热散逸，适合高密度 PCB 设计。
- 生产与采购：卷带（TR）包装适合自动贴装生产线，便于批量采购与 SMT 组装。
三、典型应用
- 同步降压转换器与点对点供电模块
- 服务器、通信设备与高性能计算平台的电源管理
- 伺服驱动与工业电机控制（中小功率）
- 高频逆变器与功率级驱动电路
该器件的高驱动电流与低寄生特性，使其在要求快速栅极切换和严格热管理的系统中表现突出。
四、封装与装配建议
- 热管理：TQFN 封装通常含底部散热焊盘，推荐在 PCB 对应位置设置充分的散热焊盘和过孔（thermal vias）以导通至内层或底层散热平面。
- 去耦与电源布局：靠近驱动器的 VCC/BOOT 输入端放置低 ESR 陶瓷电容（去耦电容），并使用宽短的电源与接地回路以降低环路阻抗。
- 引脚布局：驱动输出与功率器件连接应采用短、粗的走线，必要时并用小电阻（门极电阻）抑制振铃；逻辑输入与参考地应采取单点接地或短回路布局，避免数字噪声耦合到驱动器。
五、设计注意事项与优势总结
在应用 MP86945-AGVT-Z 时，应关注驱动回路的寄生电感、去耦策略与热路径设计，以发挥其 60A 峰值驱动能力带来的快速开关优势。该器件适合需要高开关速度、紧凑布局和可靠批量装配的功率系统。综合来看，MP86945-AGVT-Z 为追求高效率、高功率密度电源与电机控制设计提供了一个性能-封装兼顾的解决方案。若需更详细的电气参数、引脚定义或典型应用电路，请参阅 MPS 官方数据手册或联系供应商获取原厂资料。
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