WMSIC Electronic Components

MPS MP6531AGR-Z

ModelMP6531AGR-Z
PackageQFN-28(4x4)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MPS MP6531AGR-Z
Type
MPS
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MP6531AGR-Z
Electronic Component
1
Package
QFN-28(4x4)
Electronic Component
BLDC Motor Driver IC
Electronic Component
0.07g
Electronic Component
1
Integrated FET
Electronic Component
Features
Electronic Component
Electronic Component
3
Electronic Component
BM0258399875
Current
800mA
Operating Temperature
40℃~+125℃
Operating Voltage
5V~60V
Driver Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP6531AGR-Z 产品概述

一、概述

MP6531AGR-Z 为面向多相电机驱动与高性能同步降压应用的功率 MOSFET 芯片级封装解决方案。器件采用表面贴装封装(QFN-28,4×4 mm)并带有裸露焊盘,便于实现可靠的热散与低阻连接。该器件由 MPS 提供,针对高开关频率、高电流密度的电源与驱动场景做了性能和热管理优化。

二、封装与机械特性

器件封装为 28-VFQFN(28-QFN,4×4 mm),中心配有裸露焊盘(exposed pad),有利于通过 PCB 热过孔或热铜区域将热量快速传导到板层。QFN 小外形尺寸适配密集布局,适合对体积和散热有严格要求的模组化设计与模块化电源板。

三、关键电气及热性能要点

MP6531AGR-Z 适用于作为高侧或低侧功率开关,具备低导通电阻和较低栅极电荷特性,从而降低导通与开关损耗,提升效率并支持较高的开关频率。裸露焊盘和优化封装有助于降低结-壳热阻,便于在多相并联或高功率密度系统中提高热裕量与可靠性。

四、典型应用场景

  • 多相电机驱动(BLDC、无刷伺服)与电机控制器
  • 高性能同步降压稳压器(多相 VRM、服务器与通信电源)
  • 工业运动控制与驱动板
  • 高密度功率模块与电源管理子系统

五、PCB 布局与使用建议

为了发挥器件热管理优势,建议在裸露焊盘下方设计充足的铜层和若干热过孔并与内层散热层连通;MOSFET 的驱动走线应尽量短且成对对称,电源回路须实现低阻抗环路;在高开关频率应用中,宜加入合适的栅极阻尼与吸收网络以控制振铃与 EMI。

六、可靠性与制造注意

QFN-28 封装适配常见回流焊工艺,焊接时关注焊膏量与焊盘设计以避免桥连或焊接缺陷。器件经过封装级别的热与机械性能优化,适合要求紧凑布局与持续高功率运行的商业与工业电子产品。

总结:MP6531AGR-Z 以小尺寸 QFN-28 封装和裸露焊盘设计,提供面向多相电机驱动及高密度电源应用的功率 MOSFET 解决方案。合理的 PCB 散热与布局能显著提高系统效率与可靠性,适用于追求高功率密度与热性能的设计。

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