WMSIC Electronic Components

MPS MP4572GQB-Z

ModelMP4572GQB-Z
PackageQFN-12(2.5x3)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MPS MP4572GQB-Z
Type
MPS
Minimum package
3000

Technical parameters

Electronic Component
MPS
Electronic Component
MP4572GQB-Z
Electronic Component
1
Package
QFN-12(2.5x3)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.31g
Electronic Component
1
Features
Frequency Synchronous
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230044386
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.5V~60V
Switching Frequency
2.2MHz
Electronic Component
Electronic Component
Output Voltage
1V~54V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP4572GQB-Z 产品概述

一、产品简介

MP4572GQB-Z 是一款高压降压型(buck)同步整流 DC-DC 转换器,适用于宽输入电压范围的低功耗到中功率应用。芯片集成高侧与低侧开关管,可提供最高 2A 的连续输出电流,工作输入电压范围为 4.5V 至 60V,开关频率为 2.2MHz,静态电流仅 40µA,工作结温范围 -40°C 至 +125°C。芯片采用 QFN-12(2.5 × 3 mm)小封装,支持外部可调输出,适合空间受限且需要高效、稳定降压的场景。

二、主要特性

  • 宽输入电压:4.5V ~ 60V,适用汽车、工业及通信等高压工况
  • 输出电流:最高 2A 连续输出能力
  • 同步整流:内部集成同步 MOSFET,降低整流损耗、提升效率
  • 高频工作:2.2MHz 开关频率,外部无源器件体积小
  • 低静态电流:典型 Iq = 40µA,适合有待机功耗限制的系统
  • 输出类型:可调输出,便于灵活设定输出电压
  • 封装:QFN-12(2.5 × 3 mm),小尺寸、良好散热路径
  • 工作温度:-40°C ~ +125°C(结温)

三、功能描述

MP4572GQB-Z 采用降压拓扑,内部集成高低侧开关管,工作于固定 2.2MHz 开关频率。同步整流结构在轻载和重载工况均能有效降低导通与开关损耗,从而实现较高的转换效率并减小热耗。内部包含错误保护与稳压环路,输出电压通过外部分压电阻精确调整,能够满足对输出精度和动态响应的要求。高开关频率使得外部电感、电容体积可显著缩小,适合体积受限的嵌入式系统与移动设备。

四、典型应用场景

  • 汽车电子:车载子系统、传感器供电(耐高压输入)
  • 工业设备:控制模块、分布式电源、工业传感器
  • 通信设备:远端供电、网络设备的局部稳压
  • 电池供电设备:电池电压到系统核心电源的降压转换
  • 串行点式电源和小型电源模组

五、外部元器件与参考设计建议

为在不同工况下取得最佳性能,外部器件选型与布局非常关键,建议如下原则与建议值范围(供参考):

  • 输入电容:贴片陶瓷(X7R/Y5V 根据需求),靠近 VIN 引脚布置,低 ESR 有利于抑制输入纹波与尖峰电流。容量视输入滤波需求而定,通常 10µF~100µF 并联更多小电容以改善高频特性。
  • 输出电容:低 ESR 陶瓷电容优先,X5R/X7R 品质较好,容量根据输出纹波及瞬态要求选择,常见为 22µF~100µF。
  • 电感:受 2.2MHz 高频影响,常用 0.47µH~2.2µH 范围;选型时注意电感的饱和电流大于峰值电流并兼顾 DCR 以降低损耗。
  • 输出反馈电阻:根据所需输出电压设定分压比,注意 FB 引脚布局与噪声源隔离以保证精度。
  • 布局要点:缩短 VIN—GND 的回流路径,尽量将输入电容、开关节点(SW)和电感紧密布置,保持热焊盘良好接地以利散热;反馈网络及轻信号线应远离开关节点以降低噪声耦合。

六、封装与热管理

QFN-12(2.5 × 3 mm)封装便于在板上节省面积,但热阻相对较高,建议在 PCB 下方设置与芯片焊盘相连的大面积热铜箔并通过多层过孔引至内层与底层散热区,以提高热传导能力。高输入电压或高输出电流工况下需关注结温,必要时增加散热铜箔或考虑外置散热方案。

七、选型与设计注意事项

  • 输入瞬态:面对此类宽输入电压器件,需评估系统可能的瞬态过压(例如车辆启动/负载断开瞬间),并在必要处增加 TVS 或抑制网络保护器件。
  • 启动与稳定性:输出电容的等效串联电阻(ESR)会影响环路相位裕度,设计时参考厂商参考设计并调整环路补偿(若提供)以保证瞬态性能与稳定性。
  • 效率与热平衡:虽然同步整流提升效率,但在高 Vin 与高 Iout 下开关与导通损耗仍会产生明显热量,需评估系统散热方案以确保长期可靠性。
  • EMC 与滤波:高频开关易产生电磁干扰,关键节点屏蔽与滤波、走线与接地优化有助于通过 EMI 要求。

总结:MP4572GQB-Z 提供宽输入、高压耐受、2A 输出与高频工作特性,适合对体积、效率及耐压有较高要求的降压电源设计。合理的外部器件选型与 PCB 布局能显著提升器件性能与系统可靠性。若需详细原理图或参考布局,请依据厂商数据手册及参考设计进一步核实。

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