WMSIC Electronic Components

MSKSEMI 1N4001

Model1N4001
PackageDO-214AC(SMA)
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI 1N4001
Type
MSKSEMI
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
1N4001
Electronic Component
1
Package
DO-214AC(SMA)
Electronic Component
General Purpose Diode
Electronic Component
0.099g
Electronic Component
1
Electronic Component
BM0226526777
Current
1A
Diode
1
Current(Ir)
5uA
(Vf)
1.1V@1A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N4001 产品概述

一、产品简介

1N4001 是一款通用硅整流二极管,适用于直流整流、整流桥、电源保护与反向极性保护等场合。MSKSEMI(美森科)提供的该型号以 DO-214AC(SMA)表面贴装封装形式供货,便于现代PCB装配与自动化生产。根据提供的基础参数,该器件具有 1A 的整流电流能力、50V 的反向耐压以及较高的冲击浪涌承受能力,适用于中低功率电子电路。

二、主要参数

  • 二极管配置:独立式(单只)
  • 平均整流电流:1A
  • 正向压降(Vf):约 1.1V @ 1A
  • 非重复峰值浪涌电流(Ifsm):30A(一次性半正弦浪涌能力)
  • 直流反向耐压(Vr):50V
  • 封装:DO-214AC (SMA)
  • 品牌:MSKSEMI(美森科)

三、特点与优势

  • 封装适配表面贴装工艺,利于SMT流水线组装与体积优化。
  • 1A 连续整流能力满足一般电源和保护电路需求;1.1V 的正向压降在该电流下处于常见范围。
  • 30A 的浪涌承受能力使其能应对设备启动或短时过流冲击(需遵循脉冲宽度和频率限制)。
  • 50V 反向耐压适合 12V / 24V 等常见低压系统使用。

四、典型应用

  • 单相整流与整流桥模块(低功率适配器与模块)
  • 电源反向保护与极性保护电路
  • 低压直流电源的滤波与续流路径
  • 工业与消费电子中的浪涌吸收/限流场景(配合限流电阻或热熔丝)

五、封装与热管理

SMA(DO-214AC)为表面贴装封装,热阻相对较大,器件的实际允许连续电流受焊盘面积、PCB铜厚与环境散热影响。推荐做法:

  • 在PCB上扩展焊盘和散热铜箔,尤其是在器件背面和相邻层增加散热过孔。
  • 在高电流或高环境温度下对平均电流进行降额(建议在常温下将连续电流保持在 0.5–0.8A 范围内,具体取决于PCB散热设计)。
  • 注意浪涌脉冲规格(Ifsm 30A 通常基于半正弦 8.3ms 标准脉冲),避免重复长期冲击。

六、选型与使用建议

  • 若电路对正向压降敏感(需更低功耗),建议考虑肖特基二极管(如 1N5819 等);若需更高反向耐压,可选 1N4002~1N4007 系列中的更高 Vr 型号。
  • 对于开关电源或高频整流场合,应选择快速恢复或超快恢复二极管以降低反向恢复损耗。
  • 在并联使用以增加电流能力时,需注意电流分配不均问题,通常不推荐简单并联多只一般整流二极管。

七、可靠性与注意事项

  • 存储与回流焊温度应遵循制造商建议,避免因过热导致参数漂移或封装损伤。
  • 在设计中应考虑工作环境温度、脉冲冲击及长期老化,必要时做热仿真与实测验证。
  • 生产与检验时注意极性识别与贴装方向,以防电路故障。

简介总结:MSKSEMI 的 1N4001(SMA 封装)是一款面向表贴工艺的通用硅整流器件,凭借 1A 连续整流能力、50V 反向耐压与 30A 的浪涌承受力,可满足多数低压电源与保护应用。在选型时应结合散热设计与使用频率,对正向压降与反向恢复特性有更高要求时酌情选择更合适的替代器件。

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