WMSIC Electronic Components

MSKSEMI NE5532DR-MS NE5532DR

ModelNE5532DR-MS
PackageSOP-8
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI NE5532DR-MS
Type
MSKSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
NE5532DR-MS
Electronic Component
1
Package
SOP-8
Electronic Component
Operational Amplifier
Electronic Component
0.175g
Electronic Component
1
Electronic Component
BM0264464051
Operating Temperature
40℃~+85℃
Amplifier
2
(SR)
5V/us
Power Supply Voltage
2V~18V
Static Current(Iq)
6mA
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NE5532DR-MS 高性能双路运算放大器产品概述

一、产品定位与品牌背景

NE5532DR-MS是MSKSEMI(美森科) 针对工业级与消费电子场景优化的经典双路运算放大器,继承了NE5532系列的高性价比基因,同时强化了宽温可靠性与抗干扰能力。美森科作为专注模拟芯片设计的品牌,在功率器件、运算放大器领域积累了成熟的研发与制造经验,该产品可满足中高频信号放大、微弱信号调理等多场景需求,是替代传统通用运放的优选方案。

二、核心电气性能参数解析

该产品的电气参数平衡了性能与功耗,关键指标的实际应用价值突出:

  1. 增益与带宽:增益带宽积(GBP)达15MHz,在20kHz音频带宽下可提供约750倍增益(15e6÷20e3),满足音频前置放大、中频信号处理需求;
  2. 动态响应:压摆率(SR)为5V/μs,可处理1kHz频率下峰峰值达2.5V的信号(由SR=Vpp×π×f推导),避免高频信号失真;
  3. 直流精度:输入失调电压(Vos)300μV、输入失调电流(Ios)200nA、输入偏置电流(Ib)100nA,优于普通通用运放(如LM358),适合直流信号放大、传感器零漂控制;
  4. 功耗控制:单通道静态电流(Iq)6mA,总功耗适中,长期工作无明显发热,适配对功耗敏感的便携或工业设备。

三、封装与电源兼容性

  1. 封装形式:采用SOP-8贴片封装,体积紧凑(5.2mm×6.0mm×1.75mm),支持自动化贴装,适合高密度电路板设计,便于批量生产;
  2. 电源范围:
    • 单电源供电:2V~18V,覆盖低功耗便携设备(如2V锂电池供电)到高电压工业设备;
    • 双电源供电:-18V~18V(最大电源宽度Vdd-Vss=36V),兼容正负电源系统,适配需要双极性信号放大的场景(如音频差分放大)。

四、噪声与抗干扰能力

  1. 低噪声特性:1kHz下噪声密度(eN)仅5nV/√Hz,接近专业低噪声运放水平,适合微弱信号调理(如压力传感器、生物电信号放大);
  2. 共模抑制:共模抑制比(CMRR)达110dB,可有效抑制电源噪声、电磁干扰(EMI)等共模信号,提升电路抗干扰性能,适合工业现场复杂电磁环境。

五、工作温度与可靠性

该产品支持**-40℃~+85℃工业级温度范围**,可适应户外、车载、低温存储等恶劣环境;封装采用耐高温环氧树脂,长期工作稳定性可靠,降低设备维护成本。

六、典型应用场景

NE5532DR-MS因性能均衡,广泛应用于:

  1. 音频领域:功放前置放大、耳机放大器、音频均衡器;
  2. 工业控制:传感器信号调理(压力、温度、流量)、PLC模拟输入模块;
  3. 通信领域:中频信号放大、射频前端辅助放大;
  4. 电源系统:电压监控电路、电池管理系统(BMS)信号采集。

总结

NE5532DR-MS作为美森科推出的高性能双路运放,以15MHz带宽、5V/μs压摆率、低噪声与工业级温度范围为核心优势,适配多场景模拟电路设计,是平衡性能与成本的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.