Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MSKSEMI LMV331TP-MS LMV331TP
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MSKSEMI LMV331TP-MS
- Type
- MSKSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MSKSEMI
- Electronic Component
- LMV331TP-MS
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- Comparator
- Electronic Component
- 0.04g
- Power Supply
- 2.1V~5.5V
- Electronic Component
- 1
- Electronic Component
- BM0264464049
- Operating Temperature
- 40℃~+85℃
- Comparator
- Electronic Component
- Output
- TTL；CMOS
- Output Type
- Electronic Component
- Static Current(Iq)
- 50uA
- (tpd)
- 460ns
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LMV331TP-MS 产品概述
一、概述
LMV331TP-MS 是 MSKSEMI（美森科）推出的一款单路电压比较器，专为低功耗与窄电源设计场景优化。器件采用 SOT-23-5 小型封装，具有极低的静态功耗与良好的输入特性，适用于电池供电、便携式或对功耗敏感的系统。
二、主要性能参数
- 比较器数：单路
- 输入失调电压 (Vos)：800 μV
- 输入失调电压温漂 (Vos TC)：0.8 μV/°C
- 输入偏置电流 (Ib)：2 pA
- 输入失调电流 (Ios)：1 pA
- 传播延迟 (tpd)：460 ns
- 共模抑制比 (CMRR)：70 dB
- 输出类型：开漏（Open-drain），可配置为 TTL/CMOS 电平兼容（需外部上拉）
- 静态电流 (Iq)：典型 50 μA，最大可达 0.120 mA
- 工作温度范围：-40 ℃ ～ +85 ℃
- 电源范围：单电源 2.1 V ～ 5.5 V；双电源（Vee ～ Vcc）0.9 V ～ 2.75 V 或 -2.75 V ～ -0.9 V；最大电源差 (Vdd-Vss) 7 V
- 封装：SOT-23-5
三、功能特点与优势
- 低静态电流：适合电池供电与长期待机应用，降低待机功耗。
- 高精度输入特性：较小的输入失调电压与低温漂，提升门限检测精度，利于低电压差分检测。
- 低输入偏置与失调电流：适合高阻抗传感器或高阻抗分压器输入场景。
- 开漏输出且兼容 TTL/CMOS：通过外部上拉电阻轻松适配不同逻辑电平和总线结构，便于系统级集成。
- 小封装：SOT-23-5 改善 PCB 布局密度，适合空间受限产品。
四、典型应用
- 智能家居控制单元：门窗/烟感/电池监测等低功耗阈值检测。
- 可穿戴健康监测设备：心率、电池电量或传感器比较电路。
- 移动设备与充电管理：电池电压检测、欠压/过压保护参考比较。
- 低功耗传感前端与模拟开关控制。
五、设计注意事项
- 由于为开漏输出，须配置合适上拉电阻以满足响应速度与功耗平衡；上拉电压应在器件电源范围内且与系统逻辑电平匹配。
- 在高精度门限检测场合，建议对输入进行良好滤波并合理布线以降低噪声影响，利用输入失调与温漂参数进行温度补偿设计。
- 若采用双电源工作，请确保各电源轨电压及最大电源差不超过 7 V 的限制。
- 对于需要更快响应的应用，请依据 460 ns 的传播延迟预留时序裕度。
六、包装与供货
- 标准 SOT-23-5 小外形封装，便于自动贴装与批量生产。
- 推荐在物料选型阶段与供应商确认版本、曲线与长期可得性。
LMV331TP-MS 以其低功耗、小体积与良好的输入特性，为对功耗与精度有明确要求的门限检测和比较场景提供了经济且可靠的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
