WMSIC Electronic Components

MSKSEMI LLDB3

ModelLLDB3
PackageLL-34
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI LLDB3
Type
MSKSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
LLDB3
Electronic Component
1
Package
LL-34
Electronic Component
Diode
Electronic Component
0.054g
Electronic Component
1
Electronic Component
BM0226526783
Current(Ir)
10uA
(tr)
2us
Output Voltage(Vo)
5V
Current(It)
2A
Current(Ibo)
50uA
Dynamic Voltage
5V
Electronic Component
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LLDB3 产品概述(LL-34 封装)——MSKSEMI(美森科)

一、产品简介

LLDB3 为 MSKSEMI(美森科)推出的一款通用未分类半导体元器件,采用 LL-34 小型封装,面向需要在严苛温度范围内稳定工作的中等功率电源/保护类应用。器件在工作结温 -40℃ 至 +125℃ 的条件下保持规格性能,适合汽车电子、工业控制和消费类设备的电源管理与过压/过流保护场合。

二、主要参数(关键规格)

  • 工作结温范围:-40℃ ~ +125℃
  • 输出电压 Vo:5V
  • 上升时间 tr:2 μs
  • 动态转折电压:5V
  • 转折电压(范围值):28V ~ 36V
  • 漏电流 Ir:10 μA
  • 通态电流 It(最大连续电流):2 A
  • 转折电流 Ibo:50 μA
  • 品牌/产家:MSKSEMI(美森科)
  • 封装:LL-34

注:表中“转折电压/转折电流”为器件在特定工作条件下的门槛参数,建议以原厂数据手册为准以确认具体定义与测试条件。

三、关键特性与优势

  • 宽温度稳定性:-40℃ 至 +125℃ 的工作结温覆盖典型工业级与汽车级应用要求。
  • 低静态泄漏:典型漏电流仅 10 μA,有利于低功耗系统的待机与节能设计。
  • 中等至高通态能力:最大连续通态电流 2 A,可驱动较大负载或用于电源开关应用。
  • 响应速度适中:2 μs 上升时间适合多数电源监测与开关控制场景,兼顾抗毛刺能力与响应速度。
  • 高耐压范围:转折电压(28V~36V)指示器件可在较高电压事件下触发/工作,适用于低侧或高侧保护边界。

四、典型应用场景

  • 电源管理模块:作为受控输出或保护元件参与 5V 电源轨稳压/监测。
  • 过压/过流保护:在输入电压异常或浪涌条件下提供阈值动作或钳位功能。
  • 工业与汽车电子:耐高温、低漏电适合传感器供电、控制器模块、电机驱动辅助电路。
  • 消费类电子:可用于电源开关、负载选择或作为保护级器件配合主稳压器使用。

五、选型与使用建议

  • 确认定义:由于参数中“转折”与“动态转折”的定义可能依产品而异,选型前请获取并核对厂商数据手册,明确测试条件(温度、测量电流等)。
  • 热设计:2 A 连续通态需要注意封装散热,PCB 上应采用加宽走线和必要的过孔/散热铜箔,提高热传导能力。
  • 漏电控制:在低功耗或电池供电系统中,需评估器件在待机状态下的漏电对整体功耗的影响。
  • 耐压匹配:若用于输入保护,保证系统工作电压与器件转折电压范围匹配,避免误动作或未能触发保护。
  • 测试验证:在目标系统中进行温度循环、浪涌与长期老化测试,验证在实际工况下的稳定性与寿命。

六、封装与可靠性注意事项

  • LL-34 小封装适合空间受限的 PCB 布局,但散热能力有限;建议靠近散热铜区域安排或并联散热通道。
  • 焊接工艺需遵循无铅回流温度曲线,避免过高峰值温度造成封装和引脚应力。
  • 环境与可靠性:针对工业/汽车应用,需进行 ESD、抗浪涌与高低温贮存试验验证。

七、结论

LLDB3(LL-34 封装)为一款面向中等功率与保护应用的通用元器件,兼顾宽温与低漏电优势,适用于电源管理、保护与控制场景。最终选型应结合原厂完整数据手册及目标系统的电压、热和可靠性要求做详细验证。若需进一步提供原理图参考、热设计建议或与同类器件的选型对比,请提供更多具体应用信息或电路要求。

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