WMSIC Electronic Components

MSKSEMI LIS2DW12TR-MS LIS2DW12TR

ModelLIS2DW12TR-MS
PackageLGA-12(2x2)
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI LIS2DW12TR-MS
Type
MSKSEMI
Minimum package
12000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
LIS2DW12TR-MS
Electronic Component
1
Package
LGA-12(2x2)
Electronic Component
IMU Sensor / Gyroscope
Electronic Component
0.026g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0264464064
Operating Temperature
40℃~+85℃
Operating Voltage
1.71V~3.6V
Current
500nA
Interface Type
I2C;SPI
Output
12bit
Sensor Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LIS2DW12TR‑MS 姿态传感器产品概述

一、产品简介

LIS2DW12TR‑MS 是 MSKSEMI(美森科)推出的一款三轴加速度计,面向体积受限且对功耗敏感的智能终端与物联网设备。传感器能实时测量 X、Y、Z 三轴的加速度分量,提供稳定的姿态感知与运动跟踪能力,适用于位置变化检测、活动识别与低功耗唤醒场景。

二、主要技术参数

  • 传感器类型:三轴加速度计
  • 测量轴向:X、Y、Z
  • 量程(最大):±16 g
  • 输出分辨率:12 bit(4096 级,±16 g 下分辨率约 7.8 mg/LSB)
  • 接口类型:I2C、SPI(兼容常见主控)
  • 工作电压:1.71 V ~ 3.6 V
  • 待机电流:500 nA(典型低功耗待机)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:LGA‑12(2 x 2 mm)
  • 功能特性:运动事件检测(适用于唤醒、活动/静止检测等)

三、功能特点

  • 高集成度:三轴测量、数字输出,便于直接与 MCU/应用处理器对接,减轻系统设计复杂度。
  • 低功耗设计:待机电流低至 500 nA,适合电池供电的长期监测与待机唤醒应用。
  • 较宽量程与良好分辨率:±16 g 量程兼顾动态范围与细节分辨能力,12 bit 输出可满足多数姿态与振动检测需求。
  • 多种运动检测能力:内建运动事件检测机制,可用于入睡/唤醒判断、方向改变、震动监测等(便于减少主控处理与功耗)。

四、接口与电源注意事项

  • 支持 I2C 与 SPI 两种主流数字接口,选型时根据系统主控资源与传输速率需求决定接口类型。
  • 工作电压 1.71 V ~ 3.6 V,可直接与单节锂电/3.3 V 系统兼容。
  • I2C 总线建议在器件侧提供上拉电阻并注意总线速率与拉升电容匹配;SPI 使用时注意电平与时序匹配。
  • 建议在电源引脚近端放置去耦电容(例如 0.1 μF)并做好 PCB 电源回流设计,保证测量稳定性。

五、封装与环境适应

  • LGA‑12(2×2 mm)小型化封装,便于移动设备与空间受限的模块化设计。
  • 宽工作温度(-40 ℃ 至 +85 ℃)适应工业级与消费类多种环境,适合室内外混合使用场景。
  • PCB 布局建议将传感器放置在板面中心且远离大功率噪声源,减少振动与热漂移影响。

六、典型应用

  • 可穿戴设备:运动检测、姿势识别、步态分析的低功耗解决方案。
  • 智能手机/平板配件:屏幕方向锁定、摇晃唤醒等。
  • 物联网终端:入侵检测、跌落检测、设备唤醒与能耗管理。
  • 工业与运动传感器:振动监测、状态检测与位置变化记录。

七、选型与使用建议

  • 若系统对更高动态检测或更低噪声有特殊要求,建议结合具体应用进行实验评估或咨询厂商技术支持。
  • 设计时优先使用器件推荐的 PCB 布局和电源滤波方案,结合中断/事件检测功能可极大降低主控唤醒频率与系统功耗。
  • 在量产与认证前进行温度漂移和长期稳定性测试,尤其是在极限温度与高振动环境下验证性能。

LIS2DW12TR‑MS 以其小尺寸、低功耗和多接口特性,为需要长期运行与高可靠性的姿态与运动检测应用提供了实用且易于集成的解决方案。若需电气原理图示例、寄存器手册或评估板建议,可进一步索取详细资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.