WMSIC Electronic Components

MSKSEMI SK106C-MS SK106C

ModelSK106C-MS
PackageSMC
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI SK106C-MS
Type
MSKSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
SK106C-MS
Electronic Component
1
Package
SMC
Electronic Component
Schottky Diode
Electronic Component
0.405g
Electronic Component
1
Electronic Component
BM0259565677
Current
10A
Diode
1
(Vf)
850mV@10A
Electronic Component
65℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SK106C-MS 产品概述

SK106C-MS(品牌:MSKSEMI)是一款面向中高功率整流与保护应用的功率二极管,采用SMC(DO-214AB)封装,适合在要求高整流电流与冲击耐受能力的应用场景中使用。器件在10A工况下正向压降仅为850mV,具备60V反向耐压能力与250A单次非重复峰值浪涌电流,综合性能良好,适用于工业电源、开关电源、逆变器与电机控制等场合。

一、主要特性

  • 正向压降 (Vf):0.85V @ 10A,低压降有助于降低功率损耗与发热。
  • 直流反向耐压 (Vr):60V,适合48V及以下总线电压系统。
  • 整流电流:10A(持续),满足中等电流整流需求。
  • 非重复峰值浪涌电流 (Ifsm):250A,具备较强的冲击能量承受能力。
  • 工作结温范围:-65℃ ~ +125℃,适用于宽工作温度环境。
  • 封装:SMC,便于手工焊接与自动化贴装,良好散热面积。

二、电气性能要点

  • 在额定整流电流工作时,Vf 为 0.85V 左右,能显著降低导通损耗,但仍需在设计中考虑散热。
  • 60V 的反向耐压使其适用于常见的直流母线(如24V、36V、48V)保护与整流。
  • 250A 的峰值浪涌电流能力说明该器件对短时启动电流或浪涌事件具有良好缓冲能力,但不可作为长时超载条件使用。

三、封装与机械特征

  • SMC(DO-214AB)封装:具有较大的引脚和底面,有利于焊接和热量传导。
  • 推荐在 PCB 设计中为器件的焊盘提供充足铜箔面积,并根据散热需要采用多层铜与热过孔(thermal vias)回流至内部或背面散热层。

四、典型应用场景

  • 开关电源输出整流与续流二极管。
  • 逆变器与电机驱动的再生回路保护。
  • 整流模组、DC-DC 变换器和电池管理系统的保护与整流。
  • 工业电源、通信基站供电以及车载非关键电源(在允许的电压和温度范围内)。

五、热管理与可靠性建议

  • 虽然器件可在高达125℃结温工作,长期可靠性建议在典型工作点下保持结温尽量低于100℃,通过合适的 PCB 铜箔面积与散热器降低热阻。
  • 对于频繁浪涌或高散热工况,应进行热仿真与实际温升测试,必要时采取散热器、风冷或加强铜箔散热。
  • 在设计中考虑安全裕度,避免长期在额定极限条件下连续工作。

六、PCB 布局及装配要点

  • 增大铜箔面积并使用多层过孔连接散热层;在焊盘区布局对称,减少焊接应力。
  • 推荐在器件附近保留足够间距,便于散热与检修,避免被其他热源覆盖。
  • 按照厂商建议的焊盘尺寸与回流曲线进行焊接,避免过高的焊接温度和过长加热时间以保护器件。

七、选型与替代注意事项

  • 在替代器件时关注关键参数:最大反向电压、连续整流电流、峰值浪涌电流、正向压降与封装一致性。
  • 对于更低压降需求,可选择硅肖特基或低 Vf 型功率二极管;对更高电压需求则选择额定电压更高的型号。

八、总结

SK106C-MS 是一款面向中高功率整流与保护应用的稳健功率二极管,具有低正向压降、60V 反向耐压和较高浪涌承受能力。合理的 PCB 散热设计和保守的热设计余量能显著提升器件可靠性,适用于开关电源、逆变器和工业供电等多种场景。在选型与布局时,应重点关注热管理与浪涌能力匹配,确保长期稳定运行。

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