WMSIC Electronic Components

MICRONE ME6203A30M3G

ModelME6203A30M3G
PackageSOT-23
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME6203A30M3G
Type
MICRONE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
1.2V@(50mA)
Electronic Component
MICRONE
Electronic Component
ME6203A30M3G
Electronic Component
1
Package
SOT-23
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.036g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0227695458
Operating Temperature
45℃~+150℃@(Tj)
Operating Voltage
40V
Output
Electronic Component
Output Voltage
3V
Output Current
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME6203A30M3G 产品概述

一、概述

ME6203A30M3G 是南京微盟(MICRONE)推出的一款固定输出线性稳压器(LDO),输出电压为 3.0V,正极输出、单通道设计,采用常见的 SOT-23 小封装。器件面向低功耗、空间受限的电源管理场景,内部具有短路保护功能,适合电池供电与工业级应用。

二、主要特性

  • 输出类型:固定(3.0V)
  • 输出极性:正极,单通道
  • 工作电压范围:最高可达 40V(输入)
  • 最大输出电流:100mA
  • 压差(Dropout):1.2V @ 50mA(在更大电流下压差可能增大)
  • 静态电流(Iq):约 3µA,适合低功耗设计
  • 保护功能:具备短路保护(具体实现方式详见原厂资料)
  • 工作结温范围:-45℃ ~ +150℃(Tj)
  • 封装:SOT-23

三、典型应用

  • 电池供电的微控制器与传感器节点(IoT 终端、遥测)
  • 工业控制与低速数据采集模块
  • 低功耗便携设备的局部 3.0V 供电
  • 需要高输入耐压(可达 40V)的模拟/数字电源降压场景

四、设计与布局注意事项

  • 压降与功耗:线性稳压器的耗散功率 Pd = (Vin - Vout) × Iout。举例:若 Vin=12V、Vout=3V、Iout=100mA,则 Pd=0.9W,SOT-23 封装散热有限,需关注结温上升并做好 PCB 铜箔散热。
  • 压差说明:规格中给出 1.2V@50mA,若在 100mA 工作点或高温条件下,压差会增加,应保证输入电压比输出高出足够裕量以维持稳压。
  • 电容与稳定性:建议在输出端放置低 ESR 的陶瓷电容(典型 1µF10µF)以保证环路稳定性,输入端加 0.1µF1µF 去耦电容以抑制瞬态与输入阻抗。具体电容值与等效串联电阻(ESR)要求请参照原厂数据手册。
  • 保护与可靠性:短路保护能在负载异常时限制电流,但长期短路会导致器件发热,布局应兼顾散热与保护。高输入电压场景下注意浪涌与瞬态抑制。
  • 布局建议:稳压器靠近负载放置,输入与输出走短且宽的走线,去耦电容靠近引脚焊盘放置,减少环路面积以降低噪声与提高稳定性。

五、封装与选型建议

SOT-23 封装适合体积受限设计,但散热能力有限。若应用在较高输入差或持续大电流条件下,宜评估热平衡并考虑加大 PCB 散热区或选用更大散热封装。最终选型与关键参数(输出精度、PSRR、瞬态响应、详细热阻等)请以原厂数据手册为准,并在样机验证中关注温升、稳定性与保护响应。

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