WMSIC Electronic Components

MICRONE ME2108A33PG

ModelME2108A33PG
PackageSOT-89-3
BrandMICRONE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICRONE ME2108A33PG
Type
MICRONE
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICRONE
Electronic Component
ME2108A33PG
Electronic Component
1
Package
SOT-89-3
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.148g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227604915
Operating Temperature
25℃~+85℃@(TA)
Operating Voltage
900mV~6.5V
Switching Frequency
180kHz
Electronic Component
Electronic Component
Output Voltage
3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ME2108A33PG 产品概述

ME2108A33PG 是南京微盟(MICRONE)推出的一款升压型 DC-DC 电源管理芯片,针对便携式与低电压供电场景优化。器件采用升压拓扑、内置开关管、固定输出 3.3V,最大连续输出电流 400mA,输入电压范围宽(0.9V ~ 6.5V),开关频率 180kHz,封装为 SOT-89-3。器件不支持同步整流,因此需外接肖特基二极管。

一、主要特性

  • 功能类型:升压(Boost)型 DC-DC 转换器
  • 输入电压:0.9V ~ 6.5V(可在极低电压下启动/运行)
  • 输出电压:固定 3.3V(内部基准与反馈)
  • 输出电流:最大 400mA(连续)
  • 开关频率:典型 180kHz(中等频率,平衡效率与外围元件体积)
  • 同步整流:否(需外置肖特基二极管)
  • 开关管:内置(简化外围,减小设计复杂度)
  • 通道数:单通道
  • 工作温度:-25°C ~ +85°C(TA)
  • 封装:SOT-89-3(小体积,便于中小功率应用)

二、典型应用

  • 锂电/干电池驱动的便携设备(如便携式仪器、可穿戴设备)
  • 单节或并联低压电源提升至 3.3V 的系统
  • 物联网节点、无线传感器、低功耗 MCU 平台的备用增压电源
  • 小型显示、传感器驱动、模拟前端供电

三、电气与散热要点

  • 由于为升压拓扑且不支持同步整流,效率受二极管正向压降影响,运行时应选择低 Vf 的肖特基二极管以减小损耗。
  • 在最低输入电压(0.9V)且输出 3.3V、400mA 时,器件输入电流与开关应力较大,外部电感和二极管需满足较高峰值电流与饱和电流规格。
  • SOT-89-3 封装对散热有限,且环境温度影响可用输出能力,实际布局中需考虑 PCB 散热铜箔及温升限制,必要时降额使用。

四、参考外围元件与电路建议

  • 电感:选择低 DCR、饱和电流高于预计峰值电流的贴片电感;典型范围可在 10µH~47µH(根据输入电压与负载调整),但在 0.9V 输入场景建议使用更大电感量和更高电流等级。
  • 二极管:推荐低 Vf 肖特基(如 1A 级别、反向耐压 ≥ 10V~40V 的型号),以降低整流损耗。
  • 输入电容:10µF 或更大,X5R/X7R 陶瓷,靠近芯片输入端放置,降低纹波与纹波电流应力。
  • 输出电容:22µF~47µF 陶瓷,低 ESR,有利于稳定性与瞬态响应。
  • 布局:电感、二极管、输入/输出电容应靠近芯片脚位放置,环路面积尽量小,地平面完整,减少噪声耦合。

五、封装与引脚(SOT-89-3)

  • 小型三引脚封装,便于中小功率模块化设计与自动化贴片装配。
  • 采用标准 SOT-89-3 引脚排列,实际开发请参考官方完整引脚图与推荐 PCB 尺寸以保证焊接可靠性与热管理。

六、设计与调试注意事项

  • 在靠近最低输入电压时,系统效率和可用输出电流会明显下降,建议在规格边界处进行板级验证。
  • 对于连续 400mA 工作状态,应验证芯片结温与 PCB 温升,必要时增大散热铜层或使用散热过孔。
  • 若对输出纹波和噪声敏感,可在输出增加小阻尼电阻或滤波器,并注意二极管的开关噪声。

七、订购与替代件

  • 品牌:MICRONE(南京微盟),型号:ME2108A33PG,封装 SOT-89-3。
  • 在选型时可与功能接近的其它升压芯片比较(注意同步整流支持、最小输入电压、封装及热性能差异),以保证在特定应用下的可靠性与效率。

总结:ME2108A33PG 以其低启动电压、内置开关和固定 3.3V 输出,适合电池供电、需要从极低电压提升至 3.3V 的中小功率场景。设计时重点关注外部肖特基二极管、合适的电感选型以及封装散热管理,以保证稳定与可靠运行。

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