Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ME2159BM6G 是由南京微盟(MICRONE)开发的高性能 DC-DC 电源芯片,专为需要高效、紧凑的升压解决方案的应用而设计。该芯片以其卓越的性能、可靠性和小尺寸封装,成为各种电子设备中的理想选择。
ME2159BM6G 属于升压型 DC-DC 电源芯片,适用于需要将较低输入电压提升到较高输出电压的场景。这种升压结构使其特别适合于那些需要从低压电源获取高压输出的应用。
该芯片支持广泛的工作温度范围,从 -40℃ 到 +125℃,这使得它可以在各种环境条件下稳定运行,无论是在极寒还是高温条件下,都能保证其性能和可靠性。
ME2159BM6G 内置开关管,这简化了外部组件的选择和布局,减少了 PCB 空间的占用。其开关频率为 650 kHz,这个频率不仅提高了效率,还减少了噪音和电磁干扰(EMI)。
该芯片采用升压式拓扑结构,这意味着它可以将输入电压提升到一个更高的输出电压。这种结构在需要从低压电池或电源获取高压输出的应用中尤其有用。
ME2159BM6G 采用 SOT-23-6 封装,这是一种小尺寸、六引脚的封装形式。这种封装不仅节省了 PCB 空间,还提高了整体系统的集成度和可靠性。
ME2159BM6G 适用于各种需要高效升压转换的应用,例如:
ME2159BM6G 是一款高性能、紧凑且可靠的 DC-DC 电源芯片,专为需要高效升压转换的应用而设计。其广泛的工作温度范围、内置开关管和小尺寸封装,使其成为各种电子设备中的理想选择。通过选择 ME2159BM6G,工程师可以设计出更高效、更可靠、更紧凑的系统。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products